The ISL6261 is a single-phase buck regulator implementing lntel® IMVP-6® protocol, with embedded gate drivers. The heart of the ISL6261 is the patented R3 Technology™, Intersil's Robust Ripple Regulator modulator. Compared with the traditional multi-phase buck regulator, the R3 Technology™ has faster transient response. This is due to the R3 modulator commanding variable switching frequency during a load transient. lntel® Mobile Voltage Positioning (IMVP) is a smart voltage regulation technology effectively reducing power dissipation in lntel® Pentium processors. To boost battery life, the ISL6261 supports DPRSLRVR (deeper sleep) function and maximizes the efficiency via automatically changing operation modes. At heavy load in the active mode, the regulator commands the continuous conduction mode (CCM) operation. When the CPU enters deeper sleep mode, the ISL6261 enables diode emulation to maximize the efficiency at light load. Asserting the FDE pin of the ISL6261 in deeper sleep mode will further decrease the switching frequency at light load and increase the regulator efficiency. A 7-bit digital-to-analog converter (DAC) allows dynamic adjustment of the core output voltage from 0. 300V to 1. 500V. The ISL6261 has 0. 5% system voltage accuracy over temperature. A unity-gain differential amplifier provides remote voltage sensing at the CPU die. This allows the voltage on the CPU die to be accurately measured and regulated per lntel® IMVP-6 specification. Current sensing can be implemented through either lossless inductor DCR sensing or precise resistor sensing. If DCR sensing is used, an NTC thermistor network will thermally compensates the gain and the time constant variations caused by the inductor DCR change.

特性

  • Precision single-phase CORE voltage regulator
  • 0.5% system accuracy over temperature
  • Enhanced load line accuracy
  • Internal gate driver with 2A driving capability
  • Microprocessor voltage identification input
  • 7-Bit VID input
  • 0.300V to 1.500V in 12.5mV steps
  • Support VID change on-the-fly
  • Multiple current sensing schemes supported
  • Lossless inductor DCR current sensing
  • Precision resistive current sensing
  • Thermal monitor
  • User programmable switching frequency
  • Differential remote voltage sensing at CPU die
  • Overvoltage, undervoltage, and overcurrent protection
  • Pb-free plus anneal available (RoHS compliant)

产品选择

器件号 Part Status Pkg. Type Carrier Type MOQ Buy Sample
Active QFN Tube 50
Availability
Active QFN Reel 4000
Availability

文档

文档标题 language 类型 文档格式 文件大小 日期
数据手册与勘误表
ISL6261 Datasheet 数据手册 PDF 1.95 MB
应用指南 & 白皮书
AN1681: Grounding Techniques 应用文档 PDF 509 KB
AN1684: Nonideality of Ground 应用文档 PDF 397 KB
Five Easy Steps to Create a Multi-Load Power Solution 白皮书 PDF 846 KB
PCN / PDN
PCN20029A - Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products 产品变更通告 PDF 327 KB
PCN13025B - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products 产品变更通告 PDF 222 KB
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal 产品变更通告 PDF 106 KB
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump 产品变更通告 PDF 173 KB
PCN10055 - Alternate Bond Wire Material for Assembly of the Listed Intersil DFN/QFN Packaged Products - STATS ChipPAC Malaysia 产品变更通告 PDF 248 KB