The R2A20133D controls a boost converter to provide an active power factor correction. The R2A20133D adopts critical conduction mode for power factor correction and realizes high efficiency and a low switching noise by zero current switching. Because the zero current is detected by using the GND current, the ZCD Auxiliary winding is unnecessary. The feedback loop open detection, two mode overvoltage protection, overcurrent protection are built in the R2A20133D, and can constitute a power supply system of high reliability with few external parts.

特性

  • Absolute Maximum Ratings Supply voltage Vcc: 24 V Junction temperature Tj: –40 to +150°C
  • Electrical characteristics UVLO operation start voltage VH: 9.5 V ± 0.7 V UVLO operation shutdown voltage VL: 8.5 V ± 0.4 V UVLO hysteresis voltage Hysuvl: 1.0 V ± 0.4 V
  • Functions Boost converter control with critical conduction mode Two mode overvoltage protection and OVP2 Mode 1: Dynamic OVP corresponding to a voltage rise by load change Mode 2: Static OVP corresponding to overvoltage in stable. OVP2: OVP2 senses the PFC output voltage by independence pin. Feedback loop, open detection Overcurrent protection Dynamic UVP corresponding to a voltage fall by load change Frequency limiter, adjustable Zero Current Detect (ZCD) delay time, adjustable CS pin's open detection Package lineup: Pb-free SOP-8 (JEDEC)

description文档

文档标题 language 类型 文档格式 文件大小 日期
star R2A20133DSP Datasheet 日本語 数据手册 PDF 281 KB
R2A20133D Application Note 日本語 应用文档 PDF 176 KB
Industrial Ethernet PHY (R19AN0014ED0102) Rev.1.02 应用文档 PDF 1.21 MB
Industrial Ethernet PHY (R19AN0015ED0102) Rev.1.02 应用文档 PDF 1.30 MB
R2A20134SP 应用说明 应用文档 PDF 2.08 MB
R2A20112A Application Note 应用文档 PDF 224 KB
R2A20134SP Application Note 日本語 应用文档 PDF 1.11 MB
AN1681: Grounding Techniques 应用文档 PDF 509 KB
AN1684: Nonideality of Ground 应用文档 PDF 397 KB
可靠性手册 其他 PDF 15.93 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) 日本語 产品变更通告 PDF 4.86 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) 日本語 产品变更通告 PDF 3.74 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) 日本語 产品变更通告 PDF 1.46 MB
Regarding the revision of application note of R2A20114BFP 日本語 Technical Update PDF 407 KB
Notice of IRAMP terminal resistance of R2A20114AFP,R2A20114FP,and R2A20104FP 日本語 Technical Update PDF 73 KB

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