The 71V67602 3.3V CMOS SRAM is organized as 256K x 36. The 71V676 SRAM contains write, data, address and control registers. Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

特性

  • High system speed 166MHz (3.5ns clock access time)
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW), byte
  • write enable (BWE), and byte writes (BWx)
  • 3.3V core power supply
  • Power down controlled by ZZ input
  • 2.5V I/O supply (VDDQ)
  • Available in 100-pin TQFP and 119-pin BGA packages

产品选择

下单器件型号 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active PBGA 119 C 是的 Tray
Availability
Active PBGA 119 C 是的 Reel
Availability
Active TQFP 100 C 是的 Tray
Availability
Active TQFP 100 C 是的 Reel
Availability
Active TQFP 100 I 是的 Tray
Availability
Active TQFP 100 I 是的 Reel
Availability
Active PBGA 119 C 是的 Tray
Availability
Active PBGA 119 C 是的 Reel
Availability
Active TQFP 100 C 是的 Tray
Availability
Active TQFP 100 C 是的 Reel
Availability
Active TQFP 100 I 是的 Tray
Availability
Active TQFP 100 I 是的 Reel
Availability
Active PBGA 119 C 是的 Tray
Availability
Active PBGA 119 C 是的 Reel
Availability
Active TQFP 100 C 是的 Tray
Availability
Active TQFP 100 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
71V67602 Datasheet 数据手册 PDF 432 KB
PCN / PDN
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 567 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# : A0705-02 New Mold Compound for CABGA-256, FPBGA-48, FPBGA-165 产品变更通告 PDF 138 KB
PCN# : A0706-04 MSL LEVEL 4 TO MSL LEVEL 3 FOR SELECTIVE TQFP-100 DEVICES 产品变更通告 PDF 101 KB
PCN#: A-0611-02 Transfer of Assembly Build for PBGA 119 (Green & Standard) from ATK, Korea to ATP, Philippines 产品变更通告 PDF 120 KB
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA 产品变更通告 PDF 194 KB
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China 产品变更通告 PDF 164 KB
PCN#: TB-0512-01 Reel Color Changed from Blue to Black 产品变更通告 PDF 729 KB
PCN # SR-0505-02 FPBGA BQ165 Solder Pad Opening/Ball Diameter 产品变更通告 PDF 163 KB
PCN A-0506-03; Packing Material Change 产品变更通告 PDF 290 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 产品变更通告 PDF 80 KB
PCN#: A-0403-03, BGA package family 产品变更通告 PDF 38 KB
PCN#: A-0309-05, new m/c-G770 & d/a-2300 material 产品变更通告 PDF 211 KB
PCN#: A-0310-01, Green Products 产品变更通告 PDF 26 KB
PCN#:A-0305-02, new m/c G770 & 2300 d/a material 产品变更通告 PDF 197 KB
PCN#G-0302-05, New mold compound EME-G700 series 产品变更通告 PDF 65 KB
PCN#: G-0302-06, New die attach 3230 from Ablestik 产品变更通告 PDF 150 KB
PCN#:G-0303-01, new m/c G700 & 3230 d/a material 产品变更通告 PDF 138 KB
PCN# G-0206-08, Orientation of square PQFP & TQFP 产品变更通告 PDF 150 KB
PCN# G-0110-06 REV.1 Mold Compound 产品变更通告 PDF 48 KB
PCN# G-0110-06 Mold Compound 产品变更通告 PDF 47 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB
下载
71v67602z_PF IBIS Model 模型 - IBIS ZIP 13 KB