The 5962-85525 (7164 SRAM) is organized as 8K x 8 and offers a reduced power standby mode. This version also offers a battery backup data retention capability at power supply levels as low as 2V. All inputs and outputs are TTL-compatible and operation is from a single 5V supply, simplifying system designs. Fully static asynchronous circuitry is used, requiring no clocks or refreshing for operation.

特性

  • High-speed address/chip select access time – 85ns (max.)
  • Low power consumption
  • Battery backup operation – 2V data retention voltage
  • Produced with advanced CMOS high-performance technology
  • Inputs and outputs directly TTL-compatible
  • Three-state outputs
  • Available in 28-pin 600 mil ceramic DIP package
  • Military product compliant to MIL-STD-883, Class B

产品选择

下单器件型号 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active CDIP 28 M Tube
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
7164SL Data Sheet 数据手册 PDF 112 KB
PCN / PDN
PCN# : A1504-01 Change Silver Glass adhesive material 产品变更通告 PDF 27 KB
PCN# : A1503-01 New Die Coat Materials 产品变更通告 PDF 24 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP 产品变更通告 PDF 298 KB
PCN# : A-0605-03 ASE-Kaohsiung as Alternate Assembly Facility for SOJ Packages 产品变更通告 PDF 115 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs 产品变更通告 PDF 42 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 产品变更通告 PDF 80 KB
PCN#:A-0309-06 Rev1, Hermetic transfer to ATP-P1 产品变更通告 PDF 44 KB
PCN#: A-0305-04 Rev. 01, Tin Plating and Solder Dip Process at G 产品变更通告 PDF 38 KB
PCN#: A-0310-01, Green Products 产品变更通告 PDF 26 KB
PCN SR-0203-02 Wafer Fab Transfer, Fab 2 to Fab 4 产品变更通告 PDF 41 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB