The QS3384 provides a set of ten high-speed CMOS, TTL-compatible bus switches. The low ON resistance of QS3384 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce. Two banks of 5 switches are controlled by independent Bus Enable (BE) signals. The QS3384 operates at -40C to +85C.

特性

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero added ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Two enables control five bits each
  • Available in 24 pin QSOP and TSSOP packages

产品选择

器件号 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3384PAG
Active TSSOP 24 C 是的 Tube
Availability
QS3384PAG8
Active TSSOP 24 C 是的 Reel
Availability
QS3384QG
Active QSOP 24 C 是的 Tube
Availability
QS3384QG8
Active QSOP 24 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
QS3384 Datasheet 数据手册 PDF 266 KB
应用指南 &白皮书
AN-11: 5V and 3V Conversion with Zero Delay 应用文档 PDF 417 KB
Quickswitch Basics 应用文档 PDF 142 KB
AN-19: Space Reduction Via Placement 应用文档 PDF 41 KB
AN-09: CMOS Bus Switches Provide 0 Delay 应用文档 PDF 121 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts 应用文档 PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers 应用文档 PDF 68 KB
AN-13: Converting TTL to Hot Plug 应用文档 PDF 85 KB
TN-07: Analysis of QuickSwitch Behavior 应用文档 PDF 102 KB
PCN / PDN
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges 产品变更通告 PDF 39 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location 产品变更通告 PDF 544 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs 产品变更通告 PDF 42 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material 产品变更通告 PDF 196 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 产品变更通告 PDF 110 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 产品变更通告 PDF 27 KB
PDN# Logic-00-09: Obsolete PDIP Package 产品停产通告 PDF 73 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
PCN# G9911-05, To qualify low alpha mold compound. 产品变更通告 PDF 44 KB
下载
QS3384 IBIS Model 模型 - IBIS ZIP 8 KB
QS3384 Hspice Model 模型 - HSPICE ZIP 18 KB