The QS32X861 provides two sets of ten high-speed CMOS TTLcompatible bus switches. The low ON resistance of the QS32X861 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. The QS32X861 bus switch is ideal for switching digital buses, as well as for hotplug buffering and 5V to 3V conversion. The QS32X861 operates at -40C to +85C.

特性

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Available in 48-pin QVSOP package

产品选择

器件号 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS32X861Q1G
Active QVSOP 48 C 是的 Tube
Availability
QS32X861Q1G8
Active QVSOP 48 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
QS32X861 Datasheet 数据手册 PDF 291 KB
应用指南 &白皮书
AN-11: 5V and 3V Conversion with Zero Delay 应用文档 PDF 417 KB
Quickswitch Basics 应用文档 PDF 142 KB
AN-19: Space Reduction Via Placement 应用文档 PDF 41 KB
AN-09: CMOS Bus Switches Provide 0 Delay 应用文档 PDF 121 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts 应用文档 PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers 应用文档 PDF 68 KB
AN-13: Converting TTL to Hot Plug 应用文档 PDF 85 KB
TN-07: Analysis of QuickSwitch Behavior 应用文档 PDF 102 KB
PCN / PDN
PCN# : A1908-02 Adding SPEL India and Greatek Taiwan as Qualified Assembly Facilities 产品变更通告 PDF 157 KB
PCN# : A1301-01 Gold to Copper Wire 产品变更通告 PDF 99 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# : A-0605-04 UNISEM-Malaysia as Alternate Assembly Facility for QVSOP Packages 产品变更通告 PDF 102 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN# L0203-10R2 Fab 2 to Fab4 Transfer 产品变更通告 PDF 112 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
下载
QS32X861 IBIS Model 模型 - IBIS ZIP 4 KB
QS32X861 Hspice Model 模型 - HSPICE ZIP 6 KB