The QS3125 provides a set of four high-speed low resistance CMOS switches connecting inputs to outputs without propagation delay and without generating additional ground bounce noise. The QS3125 is ideal for signal and control switching since the device adds no noise, ground bounce, propagation delay, or significant power consumption to the system. The QS3125 can also be used for analog switching applications such as video. The QS3125 operates at -40C to +85C.

特性

  • Enhanced N channel FET with no inherent diode to Vcc
  • Pin compatible with the 74'125 function
  • Undershoot clamp diodes on all switch and control inputs
  • Hot-swapping, hot-docking
  • Voltage translation (5V to 3.3V)
  • Power conservation
  • Capacitance reduction and isolation (mass storage, work stations)
  • Logic replacement (data processing)
  • Clock gating
  • Bus isolation
  • Available in 16 pin QSOP and 14 pin SOIC packages

产品选择

下单器件型号 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
Active QSOP 16 C 是的 Tube
Availability
Active QSOP 16 C 是的 Reel
Availability
Active SOIC 14 C 是的 Tube
Availability
Active SOIC 14 C 是的 Reel
Availability

文档和下载

文档标题 其他语言 类型 文档格式 文件大小 日期
数据手册与勘误表
QS3125 Datasheet 数据手册 PDF 143 KB
应用指南 &白皮书
AN-11: 5V and 3V Conversion with Zero Delay 应用文档 PDF 417 KB
Quickswitch Basics 应用文档 PDF 142 KB
AN-19: Space Reduction Via Placement 应用文档 PDF 41 KB
AN-09: CMOS Bus Switches Provide 0 Delay 应用文档 PDF 121 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts 应用文档 PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers 应用文档 PDF 68 KB
AN-13: Converting TTL to Hot Plug 应用文档 PDF 85 KB
TN-07: Analysis of QuickSwitch Behavior 应用文档 PDF 102 KB
PCN / PDN
PCN# : A1905-01 Alternate Assembly Location & Change of Material Sets 产品变更通告 PDF 313 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly 产品变更通告 PDF 611 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 产品变更通告 PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green 产品变更通告 PDF 18 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph 产品变更通告 PDF 16 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph 产品变更通告 PDF 47 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT 产品变更通告 PDF 35 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material 产品变更通告 PDF 196 KB
PCN#:A-0312-01, new mold compound material - G600 产品变更通告 PDF 109 KB
PCN#:A-0312-02, new die attach material - 8290 产品变更通告 PDF 116 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer 产品变更通告 PDF 110 KB
PCN# G-0203-05 Mold Compound 产品变更通告 PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 产品变更通告 PDF 27 KB
PCN# G0106-01, Moisture Sensitive Label Change 产品变更通告 PDF 274 KB
PCN# G0005-01, Laser Top Mark 产品变更通告 PDF 24 KB
下载
QS3125 IBIS Model 模型 - IBIS ZIP 4 KB
QS3125 Hspice Model 模型 - HSPICE ZIP 6 KB