2011年4月6日

TOKYO, Japan, April 6, 2011 — Renesas Electronics Corporation (TSE: 6723) has announced the impact of the earthquake in northern Japan on March 11, on Renesas Electronics Group (“the Group”) manufacturing sites and its response to the planned blackouts. The Group intends to add details of the impact from the earthquake to its financials when confirmed information is available.

[Status of Renesas Electronics Group's factories (as of April 6, 2011, 12:00 p.m)]

Factory City/ Prefecture Operational Status Status of the investigation
1 Renesas Northern Japan Semiconductor, Inc., Tsugaru Factory (Front-end line) Goshogawara-shi, Aomori Restarted its manufacturing Restarted its manufacturing in response to the amount of electricity supply
2 Renesas Yamagata Semiconductor Co., Ltd., Tsuruoka Factory (Front-end line) Tsuruoka-shi, Yamagata Restarted its manufacturing Restarted its manufacturing in response to the amount of electricity supply
3 Renesas Electronics Corporation, Naka Factory (Front-end line) Hitachinaka-shi, Ibaraki Temporarily shutting production Currently working to restore manufacturing equipment at both the 300mm wafer fabrication line and the 200mm wafer fabrication line. Target to restart its manufacturing with limited production capacity from July, 2011
4 Renesas Electronics Corporation, Takasaki Factory (Front-end line) Takasaki-shi, Gunma Restarted part of its manufacturing Restarted manufacturing at part of its processes when there is no planned blackout being implemented
5 Renesas Electronics Corporation, Kofu Factory (Front-end line) Kai-shi, Yamanashi Restarted part of its manufacturing Restarted its manufacturing at part of its processes when there is no planned blackout being implemented

(Note) The three back-end manufacturing sites, Renesas High Components, Inc., Renesas Northern Japan Semiconductor, Inc., Yonezawa Factory and Renesas Eastern Japan Semiconductor, Tokyo Device Division, have restarted manufacturing during the time when there is no planned blackout being implemented.


The content in the press release, including, but not limited to, product prices and specifications, is based on the information as of the date indicated on the document, but may be subject to change without prior notice.