The 71V67602 3.3V CMOS SRAM is organized as 256K x 36. The 71V676 SRAM contains write, data, address and control registers. Internal logic allows the SRAM to generate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

特長

  • High system speed 166MHz (3.5ns clock access time)
  • LBO input selects interleaved or linear burst mode
  • Self-timed write cycle with global write control (GW), byte
  • write enable (BWE), and byte writes (BWx)
  • 3.3V core power supply
  • Power down controlled by ZZ input
  • 2.5V I/O supply (VDDQ)
  • Available in 100-pin TQFP and 119-pin BGA packages

製品選択

発注型名 Part Status Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type 購入/サンプル
Active PBGA 119 C はい Tray
Availability
Active PBGA 119 C はい Reel
Availability
Active TQFP 100 C はい Tray
Availability
Active TQFP 100 C はい Reel
Availability
Active TQFP 100 I はい Tray
Availability
Active TQFP 100 I はい Reel
Availability
Active PBGA 119 C はい Tray
Availability
Active PBGA 119 C はい Reel
Availability
Active TQFP 100 C はい Tray
Availability
Active TQFP 100 C はい Reel
Availability
Active TQFP 100 I はい Tray
Availability
Active TQFP 100 I はい Reel
Availability
Active PBGA 119 C はい Tray
Availability
Active PBGA 119 C はい Reel
Availability
Active TQFP 100 C はい Tray
Availability
Active TQFP 100 C はい Reel
Availability

ドキュメント&ダウンロード

タイトル 他の言語 分類 形式 サイズ 日付
データシート
71V67602 Datasheet データシート PDF 432 KB
PCN / PDN
PCN# : A1606-02 Add Greatek Taiwan as Alternate Assembly 製品変更通知 PDF 567 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w 製品変更通知 PDF 24 KB
PCN# : A0705-02 New Mold Compound for CABGA-256, FPBGA-48, FPBGA-165 製品変更通知 PDF 138 KB
PCN# : A0706-04 MSL LEVEL 4 TO MSL LEVEL 3 FOR SELECTIVE TQFP-100 DEVICES 製品変更通知 PDF 101 KB
PCN#: A-0611-02 Transfer of Assembly Build for PBGA 119 (Green & Standard) from ATK, Korea to ATP, Philippines 製品変更通知 PDF 120 KB
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA 製品変更通知 PDF 194 KB
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China 製品変更通知 PDF 164 KB
PCN#: TB-0512-01 Reel Color Changed from Blue to Black 製品変更通知 PDF 729 KB
PCN # SR-0505-02 FPBGA BQ165 Solder Pad Opening/Ball Diameter 製品変更通知 PDF 163 KB
PCN A-0506-03; Packing Material Change 製品変更通知 PDF 290 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products 製品変更通知 PDF 80 KB
PCN#: A-0403-03, BGA package family 製品変更通知 PDF 38 KB
PCN#: A-0309-05, new m/c-G770 & d/a-2300 material 製品変更通知 PDF 211 KB
PCN#: A-0310-01, Green Products 製品変更通知 PDF 26 KB
PCN#:A-0305-02, new m/c G770 & 2300 d/a material 製品変更通知 PDF 197 KB
PCN#: G-0302-06, New die attach 3230 from Ablestik 製品変更通知 PDF 150 KB
PCN#G-0302-05, New mold compound EME-G700 series 製品変更通知 PDF 65 KB
PCN#:G-0303-01, new m/c G700 & 3230 d/a material 製品変更通知 PDF 138 KB
PCN# G-0206-08, Orientation of square PQFP & TQFP 製品変更通知 PDF 150 KB
PCN# G-0110-06 REV.1 Mold Compound 製品変更通知 PDF 48 KB
PCN# G-0110-06 Mold Compound 製品変更通知 PDF 47 KB
PCN# G0106-01, Moisture Sensitive Label Change 製品変更通知 PDF 274 KB
PCN# G9911-05, To qualify low alpha mold compound. 製品変更通知 PDF 44 KB
ダウンロード
71v67602z_PF IBIS Model モデル-IBIS ZIP 13 KB