SiP, System In Package is a product in which two or more chips conform a system utilizing the package's interconnect structure. It saves lead time, space, and BOM cost in the application.

SiP has various structures and those characteristics are shown below.

Structures and Characteristics of SiP

Structure Advantage Flexibility of Memory vender High Density Heat Dissipation Cost
Chip Stack

Chip Stack

Small and High-density Circuits ☆☆☆ ☆☆ ☆☆
Side by Side

Side by Side

Good heat dissipation ☆☆☆
QFP

QFP

Low Cost ☆☆ ☆☆☆
PoP (Package on Package)

PoP (Package on Package)

High Flexibility of Memory vender ☆☆☆ ☆☆ ☆☆

SiP Packages and Applications

SiP's usage has expanded from the characteristic low level noise and high speed operations to more highly-functional products.

Shape of SiP Packages and Applications

Key Technology Supporting SiP

The advanced package technologies are employed by SiP to connect multiple chips in a package.

Key Technology Supporting SiP

PoP

PoP, Package on Package is the realization of a large scale system by separating SoC such as logic functions from the memory functions, constructing them as a separate package and attaching the selected parts last. It is possible to change the TOP Packages so there are advantages such as amount of memory used and a wider choice for vendors. Making use of high density packaging and liberalized systems, the demand is increasing with the focus on mobile products.

PoP (Package on Package) Technology