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Title Type Type Format File Size Date
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) Product Change Notice Product Change Notice PDF 4.86 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) Product Change Notice Product Change Notice PDF 3.74 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) Product Change Notice Product Change Notice PDF 1.46 MB
The change of the Die-pad size of Leadframe. (TN-SLG-A102A/E) Technical Update Technical Update PDF 116 KB
The change of tray packing wafer protection seat for wafer delivery products Technical Update Technical Update PDF 495 KB
Renesas General-Purpose ICs Power Management Linear ICs / General-Purpose Linear ICs / General-Purpose Logic ICs General Catalog Brochure Brochure PDF 5.23 MB
Renesas Semiconductor Lead-Free Packages Brochure Brochure PDF 1.32 MB
HD74BC374A (REJ03D0284-0300Z) Datasheet Datasheet PDF 113 KB
Bi-CMOS Logic IC HD74BC Series Basic Gate Characteristics Other Other PDF 51 KB
Bi-CMOS Logic IC HD74BC Series Definition Other Other PDF 67 KB
Bi-CMOS Logic IC HD74BC Series Part Number Other Other PDF 44 KB
Bi-CMOS Logic IC HD74BC Series Symbols and Terms Defined Other Other PDF 49 KB
Bi-CMOS Logic IC HD74BC Series Outline Other Other PDF 52 KB