Title | Type | Type | Format | File Size | Date | |
---|---|---|---|---|---|---|
Silicon - TSMC WaferTech (Fab 11) | ICP Test Report | ICP Test Report | 1.08 MB | |||
Wire - Nippon CuPd wire RoHS/Halogen | ICP Test Report | ICP Test Report | 431 KB | |||
Lead Frame - Shinko C7025-Ag RoHS/Halogen | ICP Test Report | ICP Test Report | 508 KB | |||
Die Attach - CRM-1076WA RoHS/Halogen | ICP Test Report | ICP Test Report | 517 KB | |||
Mold - G631 RoHS/Halogen | ICP Test Report | ICP Test Report | 483 KB | |||
IPC 1752 - TW8816-LB3-CR | Materials Composition Declaration | Materials Composition Declaration | 98 KB | |||
IPC 1752 XML - TW8816-LB3-CR | Materials Composition Declaration | Materials Composition Declaration | XML | 7 KB | ||
Wire - MK Electron CuPD Wire RoHS/Halogen | ICP Test Report | ICP Test Report | 344 KB | |||
Lead Finish - ASK Pure Tin RoHS/Halogen | ICP Test Report | ICP Test Report | 346 KB | |||
TIN | MSDS Document | MSDS Document | 38 KB | |||
CRM-1076WA | MSDS Document | MSDS Document | 182 KB | |||
EME-G631H | MSDS Document | MSDS Document | 235 KB |