The CD4069UBMS CMOS hex inverters consist of six CMOS inverter circuits. These devices are intended for all general-purpose inverter applications where the medium-power TTL-drive and logic level conversion capabilities of circuits such as the CD4009 and CD4049 hex inverter/buffers are not required. The CD4069UBMS is supplied in these 14-lead outline packages: Braze Seal DIP H4H, Frit Seal DIP H1B and Ceramic Flatpack H3W.

Features

  • High-voltage types (20V rating)
  • Standardized symmetrical output characteristics
  • Medium-speed operation: tPHL, tPLH = 30ns (typ) at 10V
  • 100% tested for quiescent current at 20V
  • Maximum input current of 1µA at 18V over full package temperature range; 100nA at 18V and +25 °C
  • Meets all requirements of JEDEC tentative standard No. 13B, "Standard Specifications for Description of 'B' Series CMOS Devices"

Applications

  • Logic inversion
  • Pulse shaping
  • Oscillators
  • High-input impedance amplifiers

Product Options

Part Number Part Status Pkg. Type Carrier Type DLA SMD Buy Sample
CD4069UBDMSR
Active SBDIP Tube 5962R9665301VCC
Availability
CD4069UBKMSR
Active CFP Tray 5962R9665301VXC
Availability

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
CD4069UBMS Datasheet Datasheet PDF 406 KB
Application Notes & White Papers
Wafer by Wafer Low Dose Rate Acceptance White Paper White Paper PDF 533 KB
AN9867: End of Life Derating: A Necessity or Overkill Application Note PDF 338 KB
AN9654: Use of Life Tested Parts Application Note PDF 224 KB
PCNs & PDNs
PCN10123 - Alternate Die Attach Material for Assembly of Intersil Hermetic Packaged Products - Intersil Palm Bay, FL. (ISP) Product Change Notice PDF 230 KB
Other
Intersil Space Products Brochure Brochure PDF 3.14 MB
PIN19011 - Price Increase for the Listed Renesas Electronics America (REA) Radiation Hardened Space Products Price Increase Notice PDF 360 KB
Standard Microcircuit Drawing 5962-96653 (CD4069UBMS) Other 0 KB
Intersil Commercial Lab Services Brochure PDF 364 KB
PA11003 - Packing Method Change for Intersil TO-xx Metal Can and Flat Pack Packaged Products Product Advisory PDF 499 KB

News & Additional Resources