The CD4049UBMS is an inverting hex buffer and features logic level conversion using only one supply voltage (VCC). The input signal high level (VIH) can exceed the VCC supply voltage when this device is used for logic-level conversions. This device is intended for use as CMOS to DTL/TTL converters and can drive directly two DTL/TTL loads. (VCC = 5V, VOL ≤ 0. 4V, and IOL ≥ 3. 3mA). The CD4049UBMS is designated as a replacement for the CD4009UB. Because the CD4049UBMS requires only one power supply, it is preferred over the CD4009UB and CD4010B and should be used in place of the CD4009UB in all inverter, current driver, or logic level conversion applications. In these applications, the CD4049UBMS is pin-compatible with the CD4009UB and can be substituted for this device in existing as well as in new designs. Terminal No. 16 is not connected internally on the CD4049UBMS; therefore, connection to this terminal is of no consequence to circuit operation. For applications not requiring high sink current or voltage conversion, the CD4069UB hex inverter is recommended. The CD4049UBMS is supplied in these 16-lead outline packages: Braze Seal DIP H4S, Frit Seal DIP H1E, Ceramic Flatpack H3X.


  • High-voltage type (20V Rating)
  • Inverting type
  • High sink current for driving 2 TTL loads
  • High-to-low level logic conversion
  • 100% tested for quiescent current at 20V
  • Maximum input current of 1µA at 18V over full package temperature range; 100nA at 18V and +25 °C
  • 5V, 10V and 15V parametric ratings


  • CMOS to DTL/TTL hex converter
  • CMOS current "Sink" or "Source" driver
  • CMOS high-to-low logic level converter

Product Options

Part Number Part Status Pkg. Type Carrier Type MOQ DLA SMD Buy Sample
Active SBDIP Tube 1 5962R9663601VEC
Active 100 5962R9663601V9A
Active CFP Tray 1 5962R9663601VXC
Active CFP Tray 1 5962R9663602VXC

Documentation & Downloads

Title Other Languages Type Format File Size Date
Datasheets & Errata
CD4049UBMS Datasheet Datasheet PDF 409 KB
Application Notes & White Papers
Wafer by Wafer Low Dose Rate Acceptance White Paper White Paper PDF 533 KB
AN9867: End of Life Derating: A Necessity or Overkill Application Note PDF 338 KB
AN9654: Use of Life Tested Parts Application Note PDF 224 KB
PCN10123 - Alternate Die Attach Material for Assembly of Intersil Hermetic Packaged Products - Intersil Palm Bay, FL. (ISP) Product Change Notice PDF 230 KB
Intersil Space Products Brochure Brochure PDF 3.14 MB
PIN19011 - Price Increase for the Listed Renesas Electronics America (REA) Radiation Hardened Space Products Price Increase Notice PDF 360 KB
Standard Microcircuit Drawing 5962-96636 (CD4049UBMS) Other 0 KB
Intersil Commercial Lab Services Brochure PDF 364 KB
PA11003 - Packing Method Change for Intersil TO-xx Metal Can and Flat Pack Packaged Products Product Advisory PDF 499 KB

News & Additional Resources