Our photocouplers use a double structure consisting of an inner resin with high optical transmittance between the light-emitting diode (LED) and the photo-diode, and an outer resin with high light shading effect on the outside.
As a result, both stable operation not influenced by external light and high sensitivity (small minimum operating input current) are achieved.
|No. / Name||Description|
|1. Creepage Distance||Shortest distance between the light emitting side pin and the light receiving side pin, along the package surface (green line in the figure above).|
|2. Insulator Thickness||Shortest distance between the light emitting side and the light receiving side insulated with resin.|
|3. Clearance (Air distance)||Space outside the resin that is the shortest distance between the light emitting side pin and the light receiving side pin. Depending on the pin shape, this distance may be the same as the outer creepage distance.|
|Package name||Width of molded body between pin lines (mm)||Length (mm)||Height (mm)||Mass (g)|
|16-pin DIP||Insulation Distances||6.5||19.8||3.6||1.02|
|8-pin DIP||Insulation Distances||6.5||9.25||3.6||0.55|
|4-pin DIP||Insulation Distances||6.5||4.6||3.6||0.26|
|6-pin SDIP||Insulation Distances||6.8||4.58||3.7||0.35|
|8-pin SDIP||Insulation Distances||6.8||5.85||3.7||0.35|
|16-pin SSOP||Insulation Distances||4.4||10.3||2||0.2|
|12-pin SSOP||Insulation Distances||4.4||5.6||2.5||0.14|
|8-pin SSOP||Insulation Distances||3.95||5.21||3.27||0.14|
|5-pin LSSO5||Insulation Distances||7.5||2.5||2.1||0.075|
|5-pin SOP||Insulation Distances||4.4||4||2.1||0.08|
|4-pin SOP||Insulation Distances||4.4||4||2.1||0.08|
|4-pin LSSOP||Insulation Distances||7.5||2.5||2.1||0.075|
|4-pin SSOP||Insulation Distances||4.4||2.7||2||0.05|
|4-pin mini flat-lead||Insulation Distances||4.6||2.5||2.1||0.05|
*Caution: The values below differ slightly depending on the lead forming type.