The CK-RA6M5 cloud kit enables users to securely connect to the cloud and explore the features of the Cortex®-M33 based RA6M5 group of MCUs and cloud services. With Renesas’ LTE Cellular CAT-M1 module RYZ014A and ethernet network connectivity options the kit provides a seamless cloud connectivity experience to most of the global cloud service providers. With Renesas Flexible Software Package (FSP) the kit has complete software stack support using FreeRTOS, AzureRTOS and other middleware stacks, thereby making it an ideal platform for efficiently developing cloud solutions and greatly reducing the time-to-market.

Visit Renesas Cloud Solutions for complete cloud solution package.

Kit Contents

  • CK-RA6M5 v1 board
  • RYZ014A PMOD (CAT-M1 Cellular Module)
  • Micro USB to A cable
  • Micro USB A/B to A adapter cable
  • SIM card
  • Antenna


  • Key Features
    • LTE CAT-M1 with RYZ014A PMOD
    • Ethernet
    • USB Full Speed Host and Device
    • Sensors:
      • Humidity and Temperature
      • Indoor Air Quality Index
      • Outdoor Air Quality Index
      • Heart rate, blood oxygen saturation (SpO2), respiration rate
      • Barometric Pressure
      • 9 axis Motion Tracking
    • 2 MEMS Microphones
    • Battery connector for portability
    • Arduino™ (Uno R3) connector
  • On-board MCU
    • RF7A6M5BH3CFC microcontroller
    • 200MHz, Arm® Cortex®-M33 core
    • 2MB Code Flash, 512KB SRAM
    • 176 pins, LQFP package
  • Ecosystem
    • MCU and Pmod current measurement points
    • 5V input through USB or external power supply
    • USB-serial converter
    • Debug on-board (SEGGER J-Link)
    • 4 user LEDS
    • One user button
    • 2 Digilent Pmod™ (SPI/UART/I2C: Type-6A and Type-2A) connectors



Title Type Date
PDF1.42 MB
Quick Start Guide
PDF1.23 MB
Application Note
PDF1.02 MB
Application Note
Related Files:
Application Note
Related Files:
Application Note
Application Note
PDF761 KB日本語
PDF1.86 MB
Manual - Development Tools
Release Note

Design & Development

Software & Tools

Software & Tools

Quick-Connect IoT PlatformQuick-Connect IoT platform enables fast prototyping by providing compatible hardware and software building blocks. Other Hardware Renesas
Flexible Software Package (FSP)FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers. Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain and Segger J-Link drivers required to use this software. No additional installations are required. Software Package Renesas

Software Downloads

Title Type Date
ZIP60.57 MB
PCB Design Files

Sample Code

Sample Code

Title Type Date
[Software=RA FSP|v4.2.0]
ZIP5.83 MB
Related Files:
Compiler: GNUARM-None
IDE: e2 studio
Sample Code
[Software=RA FSP|v4.2.0]
ZIP6.07 MB
Related Files:
Compiler: GNUARM-None
IDE: e2 studio
Sample Code

Videos & Training

Cellular-to-Cloud Development Kits

Watch a short overview of the Renesas CK-RA6M5 and CK-RX-65N certified cellular-to-cloud IoT development kits to see how they can simplify solution prototyping for your next IoT design. Visit renesas.com/cloudsolutions to get started.