Title | Information |
---|---|
Package Description | SOIC 4.90x3.90x1.50 mm 1.27mm Pitch |
Package Status | Active |
Package Type | SOIC |
Class | PLASTIC |
Package Code | DC8 |
Category | 240 |
Lead Count | 8 |
Pb (Lead) Free | No |
Length | 4.9mm |
Pb Free Category | e0 |
Width | 3.9mm |
Thickness | 1.5mm |
Peak Reflow Temp | 240.00°C |
Pitch | 1.27mm |
Package Carrier | Reel |
Pkg. Dimensions (mm) | 4.9 x 3.9 x 1.5 |
Title | Other Languages | Type | Format | File Size | Date | |
---|---|---|---|---|---|---|
PCNs & PDNs | ||||||
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP | – | Product Change Notification | 147 KB | |||
Other | ||||||
Recommended Reflow Profile | – | Product/Marketing | 135 KB | |||
13" PLASTIC REEL WITH 4" HUB | – | Carrier / Package Type | 53 KB | |||
COVER TAPE | – | Carrier / Package Type | 28 KB | |||
DC/DCG, DJ/DJG, DM/DMG, EX/EXG 8 & PC/PCG SHIPPING TUBE | – | Carrier / Package Type | 25 KB | |||
DC/DCG 8, EX/EXG 8 & PC/PCG 16 CARRIER TAPE | – | Carrier / Package Type | 28 KB | |||
SOIC MARKETING DRAWING (.050" PITCH) (EIAJ) | – | Package Outline Drawing | 134 KB | |||
DC/DCG8/14/16 PACKAGE OUTLINE (DC OR S1 TOPMARK CODE) .150" BODY WIDTH SOIC .050" PITCH | – | Carrier / Package Type | 126 KB | |||
DC8 Copper Wire IPC-1752-2 v1.1 Class 6 (MCD) | – | Materials Composition Declaration | 332 KB | |||
DC8 IPC-1752-2 v1.1 Class 6 (MCD) | – | Materials Composition Declaration | 332 KB | |||
DC8 Copper Wire IPC 1752-1 v1.01 Class 4 (MCD) | – | Materials Composition Declaration | 517 KB | |||
DC8 IPC 1752-1 v1.01 Class 4 (MCD) | – | Materials Composition Declaration | 516 KB |