概要

The R-Car E3 is an upscale to the predecessor R-Car D3 SoC for 3D graphics clusters, that brings enhanced 3D graphics rendering performance. As part of the Renesas R-Car family, the new SoC also offers the functional safety and security functions that are essential for connected cars as the role of human-machine interface (HMI) becomes more important. With these features, the R-Car E3 simplifies the task of developing robust systems capable of dealing safely with both malfunctions and cyberattacks.

The single-chip design enables the integration of a variety of systems, significantly reducing overall system development costs and achieving substantial space savings. The R-Car E3 shares the scalability of the R-Car H3 and R-Car M3 for integrated cockpits as well as the R-Car D3 for instrument clusters, establishing the highest level of software reuse. Renesas partner companies with extensive experience in the instrument cluster field are ready to provide operating systems (OS) and HMI tools in addition to system integration support. This will greatly reduce the development burden, extending software support to a wide range of vehicles, from the premium class, which currently features the high-end 3D graphics experience, to entry-class vehicles where integrated systems and full graphics are expected to become mainstream.

特点
  • Suitable solution for large panel full graphics cluster system
  • Performance and functions optimized for entry-level integrated cockpit systems
  • Compatibility with previous products enables use of existing ecosystem and access to over 250* R-Car Consortium partners

*as of Oct, 2018

Offers optimal solutions matched to ever-evolving technologies

CIS Technology Roadmap

系统框图

12.3” Full Graphics Cluster System

R-Car E3 System Block Diagram

Cockpit System for Entry Car

R-Car E3 System Block Diagram

规格
Item R-Car E3 Specifications
Product No R-Car E3 (R8J77990)
Power supply voltage 3.3/1.8 V (IO), 2.5V(Ether), 1.35 V (DDR3L), 1.03 V (core)
CPU core Arm® Cortex®-A53
Dual
Arm® Cortex®-R7
Dual Lock-Step
Cache memory L1 Instruction cache: 32 KB
L1 Operand cache: 32 KB
L2 cache: 256 KB
L1 Instruction cache: 32 KB
L1 Operand cache: 32 KB
External memory DDR3L-SDRAM
Approved standards:DDR3L-1866
Data bus width: 32 bits x 1 ch
Graphics 3D Graphics Processing Unit
Imagination Technologies’ PowerVR® Series 8XE GE8300
2D Graphics Processing Unit
Video Display Out x 2 ch (LVDS x 2 or LVDS + Digital RGB)
Video Input x 2 ch (MIPI CSI2, Digital RGB)
Up and down scaling, 1-D LUT/3D-LUT/1D-Histogram/2D-Histgram, color conversion, I/P conversion, super resolution, rotate, ordered dithering, sharpness, lossless compression/decompression, lossy compression
Distortion compensation module (IMR-LX4)
Video output check Display Output Compare Unit (DISCOM)
Video-Output-Checker (VOC)
Audio Audio DSP
Sampling rate converter × 10 ch
Serial sound interface × 10 ch
Storage interfaces USB 3.0 host interface (DRD) × 1 port (wPHY)
USB 2.0 host/function interface × 1 port (wPHY)
SD host interface × 3 ch (SDR104)
Multimedia card interface × 1 ch
PCI Express (1 lane) x 1 ch
Raw NAND Flash memory interface x 1 ch
In car network and
automotive peripherals
Media local bus (MLB) interface × 1 ch (3-pin interface)
Controller area network (CAN-FD support) interface × 2ch
Ethernet AVB 1.0-compatible MAC built in
Interface: RGMII
Ethernet AVB (802.1BA)
  • IEEE802.1BA
  • IEEE802.1AS
  • IEEE802.1Qav
  • IEEE1722
Security Crypto engine (AES, DES, Hash, RSA)
SystemRAM
Other peripherals SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch,
Audio-DMAC x 16 ch, Audio(peripheral)-DMAC x 29 ch
32bit timer x 26 ch
PWM timer × 7 ch
I2C bus interface × 9 ch
Serial communication interface (SCIF) × 11 ch
SPI multi I/O bus controller (RPC) × 2 ch (HyperFlashTM/QSPI support)
Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
Digital radio interface (DRIF) × 4 ch
Low power mode Dynamic Power Shutdown
DFS (Dynamic Frequency Scaling), DDR-SDRAM power supply backup mode
Package 552- pin Flip chip BGA (21 mm x 21 mm, 0.8 mm pitch)
Development
environment
ICE for Arm CPU available from tool vendors
Evaluation board A user system development reference platform with the following features is also available to enable the users to carry out efficient system development.
(1) Incorporates car information system-oriented peripheral circuits, providing users with an actual device verification environment.
(2) Can be used as a software development tool for application software, etc.
(3) Allows easy implementation of custom user functions.
Software Platform Support OS: Linux, Android, QNX® Neutrino® RTOS, Integrity® etc.
OpenGL ES3.1 3D graphics library, Wide variety of H.265, H.264, MPEG-4 and VC-1 for video compliant with OpenMAX IL I/F in addition to BSPs compliant with OSs standard API are available to realize complete system concept..

(Remarks)
Arm and Cortex are registered trademarks of Arm Limited.
PowerVR is a trademark of Imagination Technologies Limited.
Android is a registered trademark from Google Inc.
QNX, neutrino and Blackberry are trademarks from BlackBerry Limited, and are used with permission from QNX Software System Limited.
Green Hills Software and INTEGRITY are trademarks or registered trademarks of Green Hills Software, Inc. in the U.S. and/or internationally.
HyperFlash is a trademark of Spansion LLC in the United States and other countries.
All names of other products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

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