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These logic ICs with ultra-small package with 1-3 gate are ideal for reducing device size and allowing effective use of board space.

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文档标题 language 类型 文档格式 文件大小 日期
star HD74LV2G04A (REJ03D0088-0300Z) 日本語
数据手册
PDF 103 KB
模拟&功率器件型号速查手册
手册
PDF 3.28 MB
瑞萨 通用IC
手册
PDF 3.91 MB
瑞萨 通用IC 综合产品目录 电源线性/通用线性/通用逻辑
手册
PDF 7.03 MB
Renesas General-Purpose ICs Power Management Linear ICs / General-Purpose Linear ICs / General-Purpose Logic ICs General Catalog
手册
PDF 5.23 MB
Renesas Semiconductor Lead-Free Packages
手册
PDF 1.32 MB
单逻辑IC 单逻辑IC的型号
其他
PDF 331 KB
单逻辑IC 基本的门特性
其他
PDF 436 KB
可靠性手册
其他
PDF 15.93 MB
Uni Logic IC Basic Gate Characteristics 日本語
其他
PDF 92 KB
Uni Logic IC Part Number of Uni Logic 日本語
其他
PDF 82 KB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) 日本語
产品变更通告
PDF 4.86 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) 日本語
产品变更通告
PDF 3.74 MB
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) 日本語
产品变更通告
PDF 1.46 MB
The change of the Die-pad size of Leadframe. (TN-SLG-A102A/E) 日本語
Technical Update
PDF 116 KB
The change of tray packing wafer protection seat for wafer delivery products 日本語
Technical Update
PDF 495 KB

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文档标题 language 类型 文档格式 文件大小 日期
HD74LV2G04AUS IBIS Model
Model - Other
ZIP 26 KB