
The RA2E1 group is the RA Family’s entry-level single-chip microcontroller based on the 48MHz Arm® Cortex®-M23 core and up to 128KB code flash and 16KB SRAM memory. The optimized processing and Renesas’ low power process technology make it the industry's most energy-efficient ultra-low power MCU. The RA2E1 group supports a wide operating voltage range of 1.6V to 5.5V and a large selection of packages such as LQFP, QFN, LGA, BGA, and WLCSP. The RA2E1 provides pin and peripheral compatibility with the RA2L1 group and is ideal for battery-operated applications and other systems requiring high performance and low-energy consumption in space-constrained applications.
Title | Type | Date | |
---|---|---|---|
Datasheet
|
|||
Manual - Hardware
|
|||
Related Files:
|
Application Note
|
||
Related Files:
|
Application Note
|
||
PDF188 KB
|
Application Note
|
||
PDF163 KB
Related Files:
|
Application Note
|
||
PDF507 KB
|
Application Note
|
||
PDF510 KB
|
Application Note
|
||
PDF614 KB
|
Application Note
|
||
PDF466 KB
|
Application Note
|
||
PDF4.02 MB
Related Files:
|
Application Note
|
||
Application Note
|
|||
Related Files:
|
Application Note
|
||
PDF1.21 MB
Related Files:
|
Application Note
|
||
Application Note
|
|||
PDF2.61 MB
|
Application Note
|
||
PDF1.07 MB
Related Files:
|
Application Note
|
||
PDF619 KB
Related Files:
|
Application Note
|
||
Application Note
|
|||
PDF67 KB
|
Application Note
|
||
Related Files:
|
Application Note
|
||
Application Note
|
|||
PDF658 KB
|
Application Note
|
||
Application Note
|
|||
PDF1.74 MB
Related Files:
|
Application Note
|
||
PDF2.02 MB
|
Application Note
|
||
Application Note
|
|||
Application Note
|
|||
Application Note
|
|||
Application Note
|
|||
Application Note
|
|||
PDF3.00 MB
Related Files:
|
Application Note
|
||
PDF743 KB
|
Application Note
|
||
PDF2.53 MB
Related Files:
|
Application Note
|
||
Application Note
|
|||
Application Note
|
|||
PDF670 KB
|
Application Note
|
||
Application Note
|
|||
PDF57 KB
|
Application Note
|
||
PDF1.50 MB
Related Files:
|
Application Note
|
||
PDF1.45 MB
Related Files:
|
Application Note
|
||
PDF747 KB
|
Application Note
|
||
Application Note
|
|||
Related Files:
|
Application Note
|
||
Application Note
|
|||
Application Note
|
|||
PDF2.45 MB
Related Files:
|
Application Note
|
||
Related Files:
|
Application Note
|
||
PDF1.78 MB
Related Files:
|
Application Note
|
||
PDF645 KB
|
Application Note
|
||
Brochure
|
|||
Brochure
|
|||
Brochure
|
|||
PDF168 KB
|
Certificate
|
||
PDF143 KB
|
Certificate
|
||
Flyer
|
|||
Flyer
|
|||
Flyer
|
|||
Flyer
|
|||
General Reliability Literature
|
|||
PDF652 KB
|
Guide
|
||
Manual - Development Tools
|
|||
Manual - Development Tools
|
|||
PDF1.29 MB
|
Manual - Development Tools
|
||
Manual - Development Tools
|
|||
Manual - Development Tools
|
|||
PDF2.01 MB
|
Manual - Software
|
||
PDF2.01 MB
|
Manual - Software
|
||
Other
|
|||
Product Change Notice
|
|||
Product Change Notice
|
|||
Product Change Notice
|
|||
PDF436 KB
|
Product Reliability Report
|
||
Quick Start Guide
|
|||
Quick Start Guide
|
|||
Quick Start Guide
|
|||
PDF2.87 MB
|
Release Note
|
||
Release Note
|
|||
PDF2.82 MB
|
Release Note
|
||
Release Note
|
|||
PDF3.02 MB
|
Release Note
|
||
Release Note
|
|||
PDF2.64 MB
|
Release Note
|
||
Release Note
|
|||
Release Note
|
|||
PDF2.87 MB
|
Release Note
|
||
PDF2.32 MB
|
Release Note
|
||
Release Note
|
|||
Release Note
|
|||
PDF3.00 MB
|
Release Note
|
||
Release Note
|
|||
Release Note
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
Technical Update
|
|||
PDF289 KB
|
White Paper
|
||
White Paper
|
|||
White Paper
|
|
|
|
---|---|---|
Flexible Software Package (FSP) FSP is an enhanced software package designed to provide easy-to-use, scalable, high-quality software for embedded system designs using Renesas RA Family of Arm Microcontrollers.
Note: FSP with e² studio Installer (Platform Installer) will install the e² studio tool, FSP packs, GCC toolchain and Segger J-Link drivers required to use this software. No additional installations are required.
|
Software Package | Renesas |
QE for Capacitive Touch: Development Assistance Tool for Capacitive Touch Sensors In developing embedded system using the capacitive touch sensor of MCUs, you can easily setup initial configurations of the touch interface as well as process the tuning of sensors, and reduce development time. [Plugin for Renesas IDE "e2 studio"] [Standalone Version] [Support MCU/MPU:RA, RL78, RX, Renesas Synergy™]
|
Solution Toolkit | Renesas |
E2 emulator [RTE0T00020KCE00000R] On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RH850, R-Car D1, RL78, RX]
|
Emulator | Renesas |
E2 emulator Lite [RTE0T0002LKCE00000R] On-chip debugging emulator. Also available as a flash memory programmer. [Support MCU/MPU: RA, RE, RL78, RX]
|
Emulator | Renesas |
PG-FP6 Flash memory programmer [Programming software: Dedicated GUI-based software, the "FP6 Terminal"] [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, SuperH RISC engine, V850, 78K, R8C]
|
Programmer (Unit/SW) | Renesas |
RA Smart Configurator The Renesas RA Smart Configurator (RA SC) is a desktop application that helps you in configuring software systems (including a Board Support Package (BSP), drivers, RTOS, and middleware) for RA-Family MCUs when you are using a third-party IDE and toolchain.
|
Solution Toolkit | Renesas |
Renesas Flash Programmer (Programming GUI) Flash memory programming software [Support MCU/MPU and devices: RA, RE, RX, RL78, RH850, Renesas Synergy, Power Management, Renesas USB Power Delivery Family, ICs for Motor Driver/Actuator Driver, V850, 78KR, 78K0]
|
Programmer (Unit/SW) | Renesas |
Sensor Software Modules for Renesas MCU Platforms Middleware (FIT module and FSP module) and sample software packages that enable control and data acquisition for Renesas sensor products.
|
Sensor | Renesas |
e² studio - information for RA Family Eclipse-based Renesas integrated development environment (IDE).
[Support MCU/MPU: RA, RE, RX, RL78, RH850, Renesas Synergy, RZ]
|
IDE and Coding Tool | Renesas |
9 items
|
Title | Type | Date | |
---|---|---|---|
[Software=RA Flexible Software Package|v4.3.0],[Toolchains=GNU Arm Embedded|10.3-2021.10]] Related Files:
Application: Consumer Electronics, Key Technology Function: Application Example, HMI Compiler: GNU ARM Embedded IDE: e2 studio |
Sample Code |
||
[Software=RA FSP | v4.5.0],[Board=EK-RA2E1] ZIP3.56 MB
Related Files:
IDE: e2 studio/GCC/AC6, Keil MDK, IAR |
Sample Code |
||
ZIP17.69 MB
|
Sample Code |
||
[Toolchains=GCC Arm Embedded|10.3.1.20210824] [Software=RA FSP|v4.2.0] [Board=EK-RA2E1] ZIP12.86 MB
Related Files:
Compiler: GNU Arm Embedded IDE: e2 studio |
Sample Code |
||
ZIP1.69 MB
Related Files:
|
Sample Code |
||
ZIP9.36 MB
Related Files:
|
Sample Code |
||
Related Files:
|
Sample Code |
||
This application project discusses the considerations for securing Data at Rest in an embedded system and provides guidelines on how to use the Security MPU hardware feature of the RA Family MCUs to implement a secure Data at Rest solution. ZIP3.45 MB
Related Files:
Compiler: ARMCC IDE: e2 studio |
Sample Code |
||
[Toolchains=GCC Arm Embedded|10.3.1.20210824] [Software=RA FSP|v3.7.0] [Board=FPB-RA2E1;FPB-RA2E2] ZIP2.89 MB
Related Files:
Compiler: GNU Arm Embedded IDE: e2 studio |
Sample Code |
||
The application project uses the Flexible Software Package (FSP) of ZIP2.69 MB
Related Files:
Compiler: GNU ARM Embedded IDE: e2 studio, Keil |
Sample Code |
||
[Toolchains=GCC Arm Embedded|8.3.1.20190703] [Software=RA FSP|v3.4.0] [Board=FPB-RA2E1] ZIP2.20 MB
Related Files:
Compiler: GNU Arm Embedded IDE: e2 studio |
Sample Code |
||
ZIP2.55 MB
Related Files:
|
Sample Code |
||
ZIP2.44 MB
Related Files:
|
Sample Code |
||
ZIP2.44 MB
Related Files:
|
Sample Code |
||
[Toolchains=GCC Arm Embedded|9.2.1.20191025] [Software=RA FSP|v1.1.0] Related Files:
Function: Security Compiler: GNU Arm Embedded, IAR Compiler for Arm IDE: e2 studio, IAR EWARM |
Sample Code |
The EK-RA2E1 evaluation kit enables users to effortlessly evaluate the features of the RA2E1 MCU Group and develop embedded systems applications using Renesas' Flexible...
The RA2E1 Fast Prototyping Board comes equipped with a R7FA2E1A93CFM microcontroller and is an evaluation board specialized for prototype development for a variety of...
CPK-RA2E1 评估板可通过灵活配置软件包 (FSP) 和 e2 studio IDE,帮助用户对RA2E1 MCU 群组的特性进行无缝评估,并对嵌入系统应用程序进行开发。用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.
RA2E1 IO-Link Pressure Sensor Solution Enables Application Miniaturization | Blog Post | Feb 15, 2023 | |
Would You Like to Use a LoRa®-Based Solution from Renesas to Develop IoT Applications with Low Power Consumption? | Blog Post | Oct 25, 2022 | |
Using Example Projects to Support RA MCU Designs | Blog Post | Oct 6, 2022 | |
Achieve Ultra-Lower Designs Using the RA2E1 MCU and FSP | Blog Post | Dec 1, 2021 | |
Get Where You’re Going with the Official Renesas RA Family Guide | Blog Post | Jun 29, 2021 | |
New Entry-Level RA Family RA2E1 MCU Group for Low-Cost, Low Power and Space-Constrained Applications | Blog Post | Jan 23, 2021 |
Flash: 128kB RAM: 16kB |
● | ● | ● | ● | ● | ● | ● | ● | ● |
---|---|---|---|---|---|---|---|---|---|
Flash: 64kB RAM: 16kB |
● | ● | ● | ● | ● | ● | ● | ● | ● |
Flash: 32kB RAM: 16kB |
● | ● | ● | ● | ● | ● | |||
Pin Count Package Size Pitch |
25-pin WLBGA 2.14x2.27mm 0.4mm |
32-pin LQFP 7x7mm 0.8mm |
32-pin QFN 5x5mm 0.5mm |
36-pin LGA 4x4mm 0.5mm |
48-pin QFN 7x7mm 0.5mm |
48-pin LQFP 7x7mm 0.5mm |
64-pin BGA 4x4mm 0.4mm |
64-pin LQFP 14x14mm 0.8mm |
64-pin LQFP 10x10mm 0.5mm |
Renesas' Lab on the Cloud is an online environment where Renesas solutions, including popular evaluation boards, winning combinations and software, are hosted in a remote lab that customers access and test online.
This solution is suitable for home appliances and provides non-contact touch operation at various programmed distances using the RA2E1 32-bit MCU.