%PDF-1.5
%
1 0 obj
<>stream
application/pdfTB451: PCB Assembly Guidelines for Intersil Wafer Level Chip Scale Package DevicesRenesas
Acrobat Distiller 17.0 (Windows); modified using iTextSharp 4.1.6 by 1T3XTPCB assembly guidelines, wafer level chip scale package devices, WLCSP
endstream
endobj
2 0 obj
<>
endobj
3 0 obj
<>stream
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