Visit Booth #278 to Explore Renesas’ Newest Technologies for Data Center and Telecom Applications
17 Sep 2019
MILPITAS, California – Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced it will highlight its newest technologies for data center and telecom applications in booth #278 at the European Conference on Optical Communication (ECOC) in Dublin, Ireland, September 23-25, 2019.
At ECOC, Renesas technical experts will showcase a variety of product solutions for telecom, datacom and 5G applications.
- Telecom Applications: Renesas combines a 64 Gbaud linear trans-impedance amplifier (TIA) with a photo diode to provide a full 64 Gbaud receiver solution, suitable for µICR and IC-TROSA designs. Along with the Renesas linear driver family, these solutions showcase the full spectrum of products ideal for next-generation 400G/600G coherent optical transceivers.
- Datacom and 5G Applications: The Renesas 50G PAM4 DML driver is designed for low-cost, low-power data center applications targeting 200 Gbps, as well as 1-channel applications in emerging 5G base station communication systems. Renesas will demonstrate combining the driver with a DML mounted in an industry-standard TOSA to enable a low-cost, easy-to-use solution for 5G mid-haul and back-haul applications.
About Renesas Electronics Corporation
Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, infrastructure, and IoT applications that help shape a limitless future. Learn more at renesas.com. Follow us on LinkedIn, Facebook, Twitter, and YouTube.
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