Documentation & Downloads Search
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| Title | Type | Format | File Size | Language | Date | |
|---|---|---|---|---|---|---|
| Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) | Product Change Notice | 4.86 MB | English | |||
| Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) | Product Change Notice | 3.74 MB | English | |||
| Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) | Product Change Notice | 1.46 MB | English | |||
| The change of the Die-pad size of Leadframe. (TN-SLG-A102A/E) | Technical Update | 116 KB | English | |||
| HD74CBT1G125 Datasheet | Datasheet | 155 KB | English | |||
| The change of tray packing wafer protection seat for wafer delivery products | Technical Update | 495 KB | English | |||
| Renesas General-Purpose ICs Power Management Linear ICs / General-Purpose Linear ICs / General-Purpose Logic ICs General Catalog | Brochure | 5.23 MB | English | |||
| Renesas Semiconductor Lead-Free Packages | Brochure | 1.32 MB | English |