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Title Type Format File Size Language Date
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) Product Change Notice PDF 4.86 MB English
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) Product Change Notice PDF 3.74 MB English
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) Product Change Notice PDF 1.46 MB English
The change of the Die-pad size of Leadframe. (TN-SLG-A102A/E) Technical Update PDF 116 KB English
The change of tray packing wafer protection seat for wafer delivery products Technical Update PDF 495 KB English
Renesas General-Purpose ICs Power Management Linear ICs / General-Purpose Linear ICs / General-Purpose Logic ICs General Catalog Brochure PDF 5.23 MB English
Renesas Semiconductor Lead-Free Packages Brochure PDF 1.32 MB English
HD74BC240A (REJ03D0280-0300Z) Datasheet PDF 134 KB English
Bi-CMOS Logic IC HD74BC Series Basic Gate Characteristics Other PDF 51 KB English
Bi-CMOS Logic IC HD74BC Series Outline Other PDF 52 KB English
Bi-CMOS Logic IC HD74BC Series Symbols and Terms Defined Other PDF 49 KB English
Bi-CMOS Logic IC HD74BC Series Definition Other PDF 67 KB English
Bi-CMOS Logic IC HD74BC Series Part Number Other PDF 44 KB English