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Title Type Format File Size Language Date
Unification of a JEDEC tray and a embossed carrier tape for LQFP package (Additional Information & Correction) Product Change Notice PDF 4.86 MB English
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001B/E ) Product Change Notice PDF 3.74 MB English
Unification of a JEDEC tray and a embossed carrier tape for LQFP package ( PC-WRP-A001A/E ) Product Change Notice PDF 1.46 MB English
The change of the Die-pad size of Leadframe. (TN-SLG-A102A/E) Technical Update PDF 116 KB English
The change of tray packing wafer protection seat for wafer delivery products Technical Update PDF 495 KB English
Renesas General-Purpose ICs Power Management Linear ICs / General-Purpose Linear ICs / General-Purpose Logic ICs General Catalog Brochure PDF 5.23 MB English
Renesas Semiconductor Lead-Free Packages Brochure PDF 1.32 MB English
HD74AC245/HD74ACT245 Datasheet PDF 143 KB English
CMOS Logic IC HD74AC Series (FACT) Design Considerations Other PDF 175 KB English
CMOS Logic IC HD74AC Series (FACT) Definition of Specifications Other PDF 117 KB English
CMOS Logic IC HD74AC Series (FACT) Descriptions and Family Characteristics Other PDF 141 KB English
HD74AC Series Common Information Datasheet PDF 241 KB English