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| Title | Type | Format | File Size | Language | Date | |
|---|---|---|---|---|---|---|
| Sensor Signal Conditioning ICs for Industrial and Consumer Applications | Overview | 2.92 MB | English | |||
| Bumped Die Outline Drawing Package Code: DICE Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch | Package Outline Drawing | 696 KB | English | |||
| Bumped Die Outline Drawing Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch | Package Outline Drawing | 716 KB | English | |||
| ZSSC3224 Short-form Datasheet | Datasheet - Short-form | 245 KB | English | |||
| ZSSC3224 Datasheet | Datasheet | 1.06 MB | English | |||
| ZSSC3224-KIT Evaluation Kit Description | Manual - Development Tools | 4.14 MB | English | |||
| ZSSC3224 Evaluation Kit Software Rev. 1.1 | Software & Tools - Evaluation Software | ZIP | 8.09 MB | English | ||
| PDN# : U-10-16 PRODUCT DISCONTINUANCE NOTICE FOR SELECTIVE MC CLOCK DEVICES | End Of Life Notice | 45 KB | English |