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| Title | Type | Format | File Size | Language | Date | |
|---|---|---|---|---|---|---|
| Sensor Signal Conditioning ICs for Industrial and Consumer Applications | Overview | 2.92 MB | English | |||
| Bumped Die Outline Drawing Package Code: DICE Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch | Package Outline Drawing | 696 KB | English | |||
| Bumped Die Outline Drawing Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch | Package Outline Drawing | 716 KB | English | |||
| ZSSC3036 Datasheet | Datasheet | 827 KB | English | |||
| ZSSC3036 Short-form Datasheet | Datasheet - Short-form | 221 KB | English | |||
| ZSSC30x6 Evaluation Kit Description | Manual - Development Tools | 2.16 MB | English | |||
| ZSSC3026 and ZSSC3036 Evaluation Kit Software Rev. 3.1_3026_3036 | Software & Tools - Evaluation Software | ZIP | 8.1 MB | English | ||
| PDN# : U-10-16 PRODUCT DISCONTINUANCE NOTICE FOR SELECTIVE MC CLOCK DEVICES | End Of Life Notice | 45 KB | English |