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Title Type Format File Size Language Date
RJU60C6TDPP-AJ Datasheet Datasheet PDF 100 KB English
Semiconductor Package Mount Manual Other PDF 10.28 MB English
RJU60C6TDPP-EJ SPICE Model - SPICE ZIP 2 KB English
Semiconductor Reliability Handbook General Reliability Literature PDF 14.7 MB English
Simulation Tool for Simple DC/DC - ICs for Microcontroller Power Supply System - Software & Tools - Other ZIP 341 KB English
Changes of the shipping forms and materials by applying the unified packing specification Technical Update PDF 695 KB English
Inner box change according to dampproof bag change and dampproof bag change Technical Update PDF 3.1 MB English
Standardization of moisture-proof aluminum bags and addition of drying agent specifications (expansion of target products) Technical Update PDF 324 KB English
Package Drawing TO-220FP-2L 2pin PRSS0002ZA-A Package Outline Drawing PDF 21 KB English
Matter for Joint portion of Glass Diode taping Technical Update PDF 44 KB English
Add the carrier taping material Technical Update PDF 88 KB English
Change of inner packing label Technical Update PDF 343 KB English
RJU60C6TDPP-EJ Datasheet Datasheet PDF 80 KB English
The specification of the taping shipment commodity career tape shape is added. Technical Update PDF 130 KB English
Change of content printed on the side of inner box Technical Update PDF 31 KB English
Addition of Shipping Tray Type for LQFP2020 Packages Technical Update PDF 126 KB English
Change of Carrier Tape Material *Change from polyvinyl chloride (PVC) to polystyrene (PS). Technical Update PDF 41 KB English
Diode Common Item PIN Diodes Other PDF 82 KB English
Renesas Semiconductor Lead-Free Packages Brochure PDF 1.32 MB English
Changing the plating composition on the lead terminals (Lead-free) Technical Update PDF 28 KB English