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-- All --
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File Size
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Date
PLC# : 230018 End-of life process on select parts
End Of Life Notice
PDF
1.43 MB
English
Jan 3, 2024
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select packages
Product Change Notice
PDF
39 KB
English
Aug 29, 2018
20-TSSOP Package Outline Drawing4.4 mm Body 0.65mm PitchPGG20D1
Package Outline Drawing
PDF
205 KB
English
Jul 24, 2018
Green Products RoHS Material Declaration Certificate
Certificate
PDF
170 KB
English
Apr 30, 2018
FCT Bus Switch Cross Reference Guide
Guide
PDF
568 KB
English
Aug 10, 2016
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly
Product Change Notice
PDF
611 KB
English
Apr 14, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly
Product Change Notice
PDF
611 KB
English
Feb 15, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location
Product Change Notice
PDF
596 KB
English
Jan 28, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location
Product Change Notice
PDF
544 KB
English
Nov 13, 2015
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages
Product Change Notice
PDF
333 KB
English
Oct 22, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages
Product Change Notice
PDF
291 KB
English
Jul 21, 2015
QS3VH244 Datasheet
Datasheet
PDF
343 KB
English
May 23, 2013
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w
Product Change Notice
PDF
24 KB
English
Nov 14, 2012
Errata LEN-08-01
Device Errata
PDF
64 KB
English
Aug 18, 2008
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP
Product Change Notice
PDF
143 KB
English
Jul 31, 2008
PCN# A-0508-02: OSET Alternate Assembly Location for Green
Product Change Notice
PDF
18 KB
English
Sep 2, 2005
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph
Product Change Notice
PDF
16 KB
English
Jul 22, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph
Product Change Notice
PDF
47 KB
English
Apr 29, 2005
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT
Product Change Notice
PDF
35 KB
English
Apr 29, 2005
QS3VH244 IBIS Model
Model - IBIS
ZIP
9 KB
English
Dec 8, 2003
PCN#:A-0312-01, new mold compound material - G600
Product Change Notice
PDF
109 KB
English
Dec 3, 2003
PCN#:A-0312-02, new die attach material - 8290
Product Change Notice
PDF
116 KB
English
Dec 3, 2003
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer
Product Change Notice
PDF
110 KB
English
Jan 13, 2003
PCN# L0206-11 ICCQ Max Limit Change
Product Change Notice
PDF
9 KB
English
Aug 1, 2002
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4
Product Change Notice
PDF
27 KB
English
Apr 15, 2002
QS3VH244 Hspice Model
Model - SPICE
ZIP
17 KB
English
Aug 15, 2001
