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Search has returned 37 results
Title Type Format File Size Language Date
PLC# : 230010 End-of-Life (EOL) process on select part numbers End Of Life Notice PDF 1.11 MB English
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select packages Product Change Notice PDF 39 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
PC/PCG PACKAGE OUTLINE .150" BODY WIDTH QSOP .025" PITCH Package Outline Drawing PDF 110 KB English
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB English
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB English
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 417 KB English
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB English
QS3384 Datasheet Datasheet PDF 266 KB English
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB English
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB English
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB English
QuickSwitch Basics Application Note PDF 142 KB English
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB English
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB English
PDN# L-05-04 Selective Logic Products Obsolescence End Of Life Notice PDF 173 KB English
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB English
QS3384 Hspice Model Model - SPICE ZIP 17 KB English
QS3384 IBIS Model Model - IBIS ZIP 8 KB English
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB English
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB English
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB English
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB English
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB English
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB English
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB English
PDN# Logic-00-09: Obsolete PDIP Package End Of Life Notice PDF 73 KB English
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB English
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB English
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 99 KB English
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 61 KB English
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 118 KB English
AN-13: Converting TTL to Hot Plug Application Note PDF 83 KB English
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 66 KB English
AN-19: Space Reduction Via Placement Application Note PDF 40 KB English