Title | Type | Format | File Size | Language | Date | |
---|---|---|---|---|---|---|
PCN20029A - Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products | Product Change Notice | 326 KB | English | |||
PCN13025 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li , Taiwan and STATS ChipPAC (SCM) - Kuala Lumpur, Mal | Product Change Notice | 106 KB | English | |||
PCN13009 - Alternate Bond Wire Material and Manufacturing Facilities for Assembly of the Listed Intersil DFN/QFN Packaged Products - Advanced Semiconductor Engineering (ASECL) - Chung-Li (ASECL), Taiwan and STATS ChipPAC (SCM) - Kuala Lump | Product Change Notice | 173 KB | English | |||
ISL97678 Datasheet | Datasheet | 1.45 MB | English | |||
l32.5x5b: 32 Lead Quad Flat No-Lead Plastic Package | Package Outline Drawing | 96 KB | English |