Title | Type | Format | File Size | Language | Date | |
---|---|---|---|---|---|---|
Bumped Die Outline Drawing Package Code: DICE Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch | Package Outline Drawing | 696 KB | English | |||
Bumped Die Outline Drawing Package Code: DICE DICEW 1.503 x 2.555 x 0.375 mm Body, 0.150mm Pitch | Package Outline Drawing | 716 KB | English | |||
Bumped Die Outline Drawing Package Code: DICE DICEW 1.673 x 4.509 x 0.367 mm Body, 0.120mm Pitch | Package Outline Drawing | 988 KB | English | |||
Bumped Die Outline Drawing Package Code: DICE DICEW 1.673 x 4.509 x 0.367 mm Body, 0.150mm Pitch | Package Outline Drawing | 886 KB | English | |||
Bumped Die Outline Drawing 2.015 x 3.995 x 0.367 mm Body, 0.15mm Pitch DICEW | Package Outline Drawing | 762 KB | English | |||
PDN# : OO-20-03 Product Discontinuation Notice | End Of Life Notice | 107 KB | English | |||
HXT6204 Product Brief | Product Brief | 243 KB | English |