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Search has returned 37 results
Title Type Format File Size Language Date
9FGL02x1-04x1-06x1-08x1D Datasheet Datasheet PDF 532 KB English
AN-891 Driving LVPECL, LVDS, CML, and SSTL Logic with Universal Low-Power HCSL Outputs Application Note PDF 431 KB English
PCN# : 230011 Add alternate assembly locations on select VFQFPN packages Product Change Notice PDF 1.26 MB English
AN-805 Recommended Ferrite Beads Application Note PDF 91 KB English
PA# : 220010 Register value update on 9DBL0xxxC, 9FGL0xxxD and 9SQL495xD product family Product Advisory PDF 171 KB English
PCN# : 220015 (R1) Add Alternate Assembly Location on VFQFPN Packages Product Change Notice PDF 734 KB English
Package Outline Drawing Package Code: NLG32P1 32-VFQFPN 5.0 x 5.0 x 0.9 mm Body, 0.5 mm Pitch Package Outline Drawing PDF 194 KB English
PCN# : 220011 (R1) New Revision for 9FGL/9DBL Family Product Change Notice PDF 120 KB English
PCN# : 220015 Add Alternate Assembly Location on VFQFPN Packages Product Change Notice PDF 728 KB English
PCI Express Timing Solutions Overview Overview PDF 2.4 MB English
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.99 MB English
9FGL0451 IBIS Model Model - IBIS ZIP 49 KB English
PCN# : TP1910-02 Metal Change to Enhance Spread Performance Product Change Notice PDF 127 KB English
PCN# : A1904-01 Add Greatek, Taiwan as an Alternate Assembly Facility Product Change Notice PDF 983 KB English
Timing Products for NXP (Freescale) i.MX Guide PDF 321 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
Package Outline Drawing Package Code: NLG32P3 32-VFQFPN 5.00 x 5.00 x 0.85 mm Body, 0.50mm Pitch Package Outline Drawing PDF 194 KB English
Package Outline Drawing Package Code: NLG32P2 32-VFQFPN 5.0 x 5.0 x 0.9 mm Body, 0.5 mm Pitch Package Outline Drawing PDF 194 KB English
Package Outline Drawing Package Code: NLG32P5 32-VFQFPN 5.00 x 5.00 x 0.85 mm Body, 0.50 mm Pitch Package Outline Drawing PDF 194 KB English
Package Outline Drawing Package Code: NLG32P4 32-VFQFPN 5.0 x 5.0 x 0.9 mm Body, 0.5 mm Pitch Package Outline Drawing PDF 194 KB English
AN-975 Cascading PLLs Application Note PDF 255 KB English
9FGL04 Evaluation Board Schematic Schematic PDF 34 KB English
PCN# : A1611-02 Add JCET China as Alternate Assembly and Change of Material Set at Alternate Assembly Location Product Change Notice PDF 583 KB English
9FGL0441 IBIS Model Model - IBIS ZIP 89 KB English
PCN# : MM1610-01 Improve performance to meet the new PCIe Product Change Notice PDF 23 KB English
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB English
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB English
AN-879 Low-Power HCSL vs Traditional HCSL Application Note PDF 235 KB English
AN-843 PCI Express Reference Clock Requirements Application Note PDF 1.9 MB English
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 495 KB English
AN-840 Jitter Specifications for Timing Signals Application Note PDF 442 KB English
AN-839 RMS Phase Jitter Application Note PDF 233 KB English
AN-835 Differential Input with VCMR being VIH Referenced Application Note PDF 160 KB English
AN-836 Differential Input to Accept Single-ended Levels Application Note PDF 120 KB English
AN-815 Understanding Jitter Units Application Note PDF 565 KB English
AN-802 Crystal-Measuring Oscillator Negative Resistance Application Note PDF 136 KB English
PCN# A-0603-02 CARSEM as Alternate Assembly Location Product Change Notice PDF 120 KB English