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Search has returned 29 results
Title Type Format File Size Language Date
AN-891 Driving LVPECL, LVDS, CML, and SSTL Logic with Universal Low-Power HCSL Outputs Application Note PDF 431 KB English
9DBL08x3 IBIS Model Model - IBIS ZIP 100 KB English
AN-805 Recommended Ferrite Beads Application Note PDF 91 KB English
Package Outline Drawing Package Code: NDG48P3 48-VFQFPN 6.0 x 6.0 x 0.9 mm Body, 0.4 mm Pitch Package Outline Drawing PDF 195 KB English
9DBL02x3-04x3-06x3-08x3 Family Datasheet Datasheet PDF 482 KB English
Package Outline Drawing Package Code: NDG48P1 48-VFQFPN 6.0 x 6.0 x 0.9 mm Body, 0.4 mm Pitch Package Outline Drawing PDF 193 KB English
PCN# : 220015 (R1) Add Alternate Assembly Location on VFQFPN Packages Product Change Notice PDF 734 KB English
PCN# : 220015 Add Alternate Assembly Location on VFQFPN Packages Product Change Notice PDF 728 KB English
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.99 MB English
Package Outline Drawing Package Code: NDG48P5 48-VFQFPN 6 x 6 x 0.9 mm Body, 0.4mm Pitch Package Outline Drawing PDF 197 KB English
PCN# : A1904-01 Add Greatek, Taiwan as an Alternate Assembly Facility Product Change Notice PDF 983 KB English
Package Outline Drawing Package Code: NDG48P4 48-VFQFPN 6.0 x 6.0 x 0.9 mm Body, 0.4 mm Pitch Package Outline Drawing PDF 193 KB English
Package Outline Drawing Package Code: NDG48S1 48-VFQFPN 6.0 x 6.0 x 0.9 mm Body, 0.4 mm Pitch Package Outline Drawing PDF 198 KB English
Timing Products for NXP (Freescale) i.MX Guide PDF 321 KB English
48-VFQFPN Package Outline Drawing 6.0 x 6.0 x 0.90 mm Body, Epad 4.1 x 4.1 mm, 0.40mm Pitch NDG48P1 Package Outline Drawing PDF 130 KB English
Package Outline Drawing Package Code: NDG48P2 48-VFQFPN 6.0 x 6.0 x 0.9 mm Body, 0.4mm Pitch Package Outline Drawing PDF 192 KB English
9DBL08 Evaluation Board Schematic Schematic PDF 65 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
AN-975 Cascading PLLs Application Note PDF 255 KB English
PCN# : A1611-02 Add JCET China as Alternate Assembly and Change of Material Set at Alternate Assembly Location Product Change Notice PDF 583 KB English
AN-879 Low-Power HCSL vs Traditional HCSL Application Note PDF 235 KB English
AN-843 PCI Express Reference Clock Requirements Application Note PDF 1.9 MB English
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 495 KB English
AN-840 Jitter Specifications for Timing Signals Application Note PDF 442 KB English
AN-839 RMS Phase Jitter Application Note PDF 233 KB English
AN-835 Differential Input with VCMR being VIH Referenced Application Note PDF 160 KB English
AN-836 Differential Input to Accept Single-ended Levels Application Note PDF 120 KB English
AN-815 Understanding Jitter Units Application Note PDF 565 KB English
AN-802 Crystal-Measuring Oscillator Negative Resistance Application Note PDF 136 KB English