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Search has returned 45 results
Title Type Format File Size Language Date
Termination Options for High-Speed LVCMOS Driver Clock Drivers Application Note PDF 187 KB English
AN-805 Recommended Ferrite Beads Application Note PDF 91 KB English
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.99 MB English
Clock Distribution Overview Overview PDF 217 KB English
PCN# : A1809-02 Add Alternate Assembly Location on select Packages Product Change Notice PDF 25 KB English
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select packages Product Change Notice PDF 39 KB English
20-TSSOP Package Outline Drawing4.4 mm Body 0.65mm PitchPGG20D1 Package Outline Drawing PDF 205 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
PDN# : CQ-17-04(R1) Product Discontinuance Notice End Of Life Notice PDF 606 KB English
PDN# : CQ-17-04 Product Discontinuance Notice End Of Life Notice PDF 599 KB English
AN-828 Termination - LVPECL Application Note PDF 322 KB English
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB English
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB English
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB English
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB English
AN-844 Termination - AC Coupling Clock Receivers Application Note PDF 170 KB English
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 495 KB English
AN-840 Jitter Specifications for Timing Signals Application Note PDF 442 KB English
AN-834 Hot-Swap Recommendations Application Note PDF 153 KB English
AN-815 Understanding Jitter Units Application Note PDF 565 KB English
PCN# : A1208-01R1 Gold to Copper Wire Product Change Notice PDF 254 KB English
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB English
74FCT3807D-E Datasheet Datasheet PDF 110 KB English
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 143 KB English
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB English
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB English
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB English
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB English
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB English
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB English
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB English
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB English
74FCT3807D/E IBIS Model Model - IBIS ZIP 8 KB English
74FCT3807D/E Hspice Model Model - SPICE ZIP 30 KB English
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB English
PCN# L0203-09R1 Tech Upgrade & Fab Transfer Product Change Notice PDF 98 KB English
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB English
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB English
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB English
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB English
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB English
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB English
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB English