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-- All --
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File Size
Language
Date
PLC# : 230018 End-of life process on select parts
End Of Life Notice
PDF
1.43 MB
English
Jan 3, 2024
PLC# : 230001 End-of- Life (EOL) process on select part numbers
End Of Life Notice
PDF
1.29 MB
English
Jan 31, 2023
PLC# : 220006(R1) End-of-Life (EOL) Process on Select Part Numbers
End Of Life Notice
PDF
1.22 MB
English
Sep 7, 2022
PLC# : 220006 End-of-Life (EOL) Process on Select Part Numbers
End Of Life Notice
PDF
1.15 MB
English
Aug 15, 2022
PLC# : 220001-R1 End-of-Life (EOL) Process on Select Part Numbers
End Of Life Notice
PDF
938 KB
English
Feb 28, 2022
PLC# : 220001 End-of-Life (EOL) Process on Select Part Numbers
End Of Life Notice
PDF
909 KB
English
Jan 20, 2022
74FCT3244 Datasheet
Datasheet
PDF
58 KB
English
Feb 12, 2020
PCN# : A1809-02 Add Alternate Assembly Location on select Packages
Product Change Notice
PDF
25 KB
English
Sep 25, 2018
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select packages
Product Change Notice
PDF
39 KB
English
Aug 29, 2018
20-TSSOP Package Outline Drawing4.4 mm Body 0.65mm PitchPGG20D1
Package Outline Drawing
PDF
205 KB
English
Jul 24, 2018
Green Products RoHS Material Declaration Certificate
Certificate
PDF
170 KB
English
Apr 30, 2018
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly
Product Change Notice
PDF
611 KB
English
Apr 14, 2016
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly
Product Change Notice
PDF
611 KB
English
Feb 15, 2016
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location
Product Change Notice
PDF
596 KB
English
Jan 28, 2016
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location
Product Change Notice
PDF
544 KB
English
Nov 13, 2015
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages
Product Change Notice
PDF
333 KB
English
Oct 22, 2015
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages
Product Change Notice
PDF
291 KB
English
Jul 21, 2015
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w
Product Change Notice
PDF
24 KB
English
Nov 14, 2012
PCN# : TB0808-04 QTY PER TUBE CHANGE FOR SSOP-20
Product Change Notice
PDF
55 KB
English
Oct 13, 2008
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP
Product Change Notice
PDF
143 KB
English
Jul 31, 2008
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil
Product Change Notice
PDF
223 KB
English
Oct 7, 2006
PCN# A-0508-02: OSET Alternate Assembly Location for Green
Product Change Notice
PDF
18 KB
English
Sep 2, 2005
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph
Product Change Notice
PDF
38 KB
English
Aug 4, 2005
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph
Product Change Notice
PDF
16 KB
English
Jul 22, 2005
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph
Product Change Notice
PDF
47 KB
English
Apr 29, 2005
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT
Product Change Notice
PDF
35 KB
English
Apr 29, 2005
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs
Product Change Notice
PDF
42 KB
English
Jan 25, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products
Product Change Notice
PDF
80 KB
English
Dec 14, 2004
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP
Product Change Notice
PDF
21 KB
English
Oct 22, 2004
PCN # L0203-09R2 Addendum Fab Transfer from Fab 2 to Fab 4
Product Change Notice
PDF
101 KB
English
Aug 16, 2004
PCN#:A-0401-01, new m/c G600 & 8290 d/a material
Product Change Notice
PDF
196 KB
English
Jan 19, 2004
PCN#:A-0312-01, new mold compound material - G600
Product Change Notice
PDF
109 KB
English
Dec 3, 2003
PCN#:A-0312-02, new die attach material - 8290
Product Change Notice
PDF
116 KB
English
Dec 3, 2003
PCN#: A-0310-01, Green Products
Product Change Notice
PDF
26 KB
English
Oct 10, 2003
PCN # L0307-02 Die Rev. change from PB to Z
Product Change Notice
PDF
94 KB
English
Aug 1, 2003
PCN# L0203-09R1 Tech Upgrade & Fab Transfer
Product Change Notice
PDF
98 KB
English
May 29, 2003
PCN#: G-0303-04, new m/c G700 & 8290 d/a material
Product Change Notice
PDF
130 KB
English
Apr 14, 2003
PCN# G-0203-05 Mold Compound
Product Change Notice
PDF
40 KB
English
Apr 16, 2002
PCN# G0202-01, Alternate assembly facility
Product Change Notice
PDF
16 KB
English
Feb 8, 2002
PCN# G0106-01, Moisture Sensitive Label Change
Product Change Notice
PDF
274 KB
English
Jun 11, 2001
PDN# Logic-00-09: Obsolete PDIP Package
End Of Life Notice
PDF
73 KB
English
Apr 25, 2001
74FCT3244 Hspice Model
Model - SPICE
ZIP
18 KB
English
Jan 4, 2001
74FCT3244 IBIS Model
Model - IBIS
ZIP
7 KB
English
Sep 1, 2000
PCN# G0005-01, Laser Top Mark
Product Change Notice
PDF
24 KB
English
May 10, 2000
PCN# G9911-05, To qualify low alpha mold compound.
Product Change Notice
PDF
44 KB
English
Nov 18, 1999
AN-124: 3.3V Logic Characteristics
Application Note
PDF
172 KB
English
Jan 2, 1996
