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Search has returned 35 results
Title Type Format File Size Language Date
Termination Options for High-Speed LVCMOS Driver Clock Drivers Application Note PDF 187 KB English
AN-805 Recommended Ferrite Beads Application Note PDF 91 KB English
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.99 MB English
Clock Distribution Overview Overview PDF 217 KB English
PCN# : A1809-02 Add Alternate Assembly Location on select Packages Product Change Notice PDF 25 KB English
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select packages Product Change Notice PDF 39 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
AN-828 Termination - LVPECL Application Note PDF 322 KB English
PYG20 PACKAGE OUTLINE 5.3mm SSOP Package Outline Drawing PDF 33 KB English
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB English
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB English
IDT Fanout Buffers Product Overview Product Brief PDF 739 KB English
AN-844 Termination - AC Coupling Clock Receivers Application Note PDF 170 KB English
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 495 KB English
AN-840 Jitter Specifications for Timing Signals Application Note PDF 442 KB English
AN-834 Hot-Swap Recommendations Application Note PDF 153 KB English
AN-815 Understanding Jitter Units Application Note PDF 565 KB English
PCN# : A1208-01R1 Gold to Copper Wire Product Change Notice PDF 254 KB English
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB English
High-Performance, Low-Phase Noise Clocks Buffers product brief Product Brief PDF 378 KB English
74FCT20807 Datasheet Datasheet PDF 109 KB English
IDT Clock Buffers Offers Ultra Low Additive Phase Jitter Application Note PDF 1.28 MB English
PCN# : TB0808-04 QTY PER TUBE CHANGE FOR SSOP-20 Product Change Notice PDF 55 KB English
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB English
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB English
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB English
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB English
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB English
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB English
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB English
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB English
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB English
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB English
74FCT20807 Hspice Model Model - SPICE ZIP 15 KB English
74FCT20807 IBIS Model Model - IBIS ZIP 8 KB English