Documentation & Downloads Search
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| Title | Type | Format | File Size | Language | Date | |
|---|---|---|---|---|---|---|
| SOIC MARKETING DRAWING (.050" PITCH) (EIAJ) | Package Outline Drawing | 134 KB | English | |||
| PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP | Product Change Notice | 143 KB | English | |||
| PCN# : A0704-01 (R1) UNISEM Malaysia as Alternate Assembly Facility | Product Change Notice | 490 KB | English | |||
| PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil | Product Change Notice | 223 KB | English | |||
| PCN# L-0607-01R1 MSL 3 to MSL 1 for ICS Classic Products | Product Change Notice | 379 KB | English | |||
| PCN# : L-0607-01 MSL 3 to MSL 1 for ICS Classic Products | Product Change Notice | 305 KB | English | |||
| PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP | Product Change Notice | 298 KB | English |