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-- All --
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Date
72401/72403 Datasheet
Datasheet
PDF
212 KB
English
Aug 22, 2019
PDN# : CQ-14-06R1 Revised Product Discontinuance Notice
End Of Life Notice
PDF
407 KB
English
Sep 8, 2014
PDN# : CQ-14-06 MANUFACTURING DISCONTINUANCE NOTICE
End Of Life Notice
PDF
192 KB
English
Sep 4, 2014
SOIC MARKETING DRAWING (.050" PITCH) (EIAJ)
Package Outline Drawing
PDF
134 KB
English
Mar 18, 2013
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w
Product Change Notice
PDF
24 KB
English
Nov 14, 2012
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP
Product Change Notice
PDF
143 KB
English
Jul 31, 2008
PCN# : A0704-01 (R1) UNISEM Malaysia as Alternate Assembly Facility
Product Change Notice
PDF
490 KB
English
Oct 6, 2007
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil
Product Change Notice
PDF
223 KB
English
Oct 7, 2006
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil
Product Change Notice
PDF
223 KB
English
Oct 7, 2006
PCN# L-0607-01R1 MSL 3 to MSL 1 for ICS Classic Products
Product Change Notice
PDF
379 KB
English
Oct 7, 2006
PCN# : L-0607-01 MSL 3 to MSL 1 for ICS Classic Products
Product Change Notice
PDF
305 KB
English
Aug 4, 2006
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP
Product Change Notice
PDF
298 KB
English
May 26, 2006
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP
Product Change Notice
PDF
298 KB
English
May 26, 2006
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs
Product Change Notice
PDF
42 KB
English
Jan 25, 2005
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products
Product Change Notice
PDF
80 KB
English
Dec 14, 2004
PCN#:A-0309-06 Rev1, Hermetic transfer to ATP-P1
Product Change Notice
PDF
44 KB
English
Oct 15, 2004
PCN#: A-0305-04 Rev. 01, Tin Plating and Solder Dip Process at G
Product Change Notice
PDF
38 KB
English
Mar 4, 2004
PCN#:A-0401-01, new m/c G600 & 8290 d/a material
Product Change Notice
PDF
196 KB
English
Jan 19, 2004
PCN#: A-0310-01, Green Products
Product Change Notice
PDF
26 KB
English
Oct 10, 2003
PCN# G-0203-05 Mold Compound
Product Change Notice
PDF
40 KB
English
Apr 16, 2002
PCN# G0106-01, Moisture Sensitive Label Change
Product Change Notice
PDF
274 KB
English
Jun 11, 2001
PDN for selected Military grade FIFO products
End Of Life Notice
PDF
44 KB
English
Feb 5, 2001
PCN# G0005-01, Laser Top Mark
Product Change Notice
PDF
24 KB
English
May 10, 2000
PCN# G9911-05, To qualify low alpha mold compound.
Product Change Notice
PDF
44 KB
English
Nov 18, 1999
