Title | Type | Format | File Size | Language | Date | |
---|---|---|---|---|---|---|
72275/72285 Datasheet | Datasheet | 769 KB | English | |||
PDN# : CQ-14-08 Manufacturing Discontinuance PDN | End Of Life Notice | 486 KB | English | |||
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w | Product Change Notice | 24 KB | English | |||
A-0603-04 Transfer TQFP and PQFP from ASAT HK to ASAT China | Product Change Notice | 164 KB | English | |||
PCN A-0506-03; Packing Material Change | Product Change Notice | 290 KB | English | |||
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products | Product Change Notice | 80 KB | English | |||
PCN#: A-0310-01, Green Products | Product Change Notice | 26 KB | English | |||
PCN#G-0302-05, New mold compound EME-G700 series | Product Change Notice | 65 KB | English | |||
PCN#: G-0302-06, New die attach 3230 from Ablestik | Product Change Notice | 150 KB | English | |||
PCN# G-0206-08, Orientation of square PQFP & TQFP | Product Change Notice | 150 KB | English | |||
PCN# G-0110-06 REV.1 Mold Compound | Product Change Notice | 48 KB | English | |||
PCN# G0106-01, Moisture Sensitive Label Change | Product Change Notice | 274 KB | English | |||
PCN# G9911-05, To qualify low alpha mold compound. | Product Change Notice | 44 KB | English | |||
72285 HSPICE | Model - SPICE | TAR | 32 KB | English | ||
72285 IBIS | Model - IBIS | ZIP | 11 KB | English |