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| Title | Type | Format | File Size | Language | Date | |
|---|---|---|---|---|---|---|
| 18 LD P-DIP MARKETING DRAWING (300 MIL) | Package Outline Drawing | 78 KB | English | |||
| PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP | Product Change Notice | 298 KB | English |