Title | Type | Format | File Size | Language | Date | |
---|---|---|---|---|---|---|
Package Outline Drawing Package Code: DCG8D3 8-SOIC 4.90 x 3.90 x 1.75 mm Body, 1.27mm Pitch | Package Outline Drawing | 194 KB | English | |||
Package Outline Drawing Package Code: DCG8D1 8-SOIC 4.82 x 3.81 x 1.72 mm Body, 1.27mm Pitch | Package Outline Drawing | 193 KB | English | |||
Package Outline Drawing Package Code:DCG8D4 8-SOIC 4.9 x 3.9 x 1.75 mm Body, 1.27mm Pitch | Package Outline Drawing | 196 KB | English | |||
8-SOIC Package Outline Drawing 0.150" Body Width, 0.050" Pitch DCG8D1 | Package Outline Drawing | 134 KB | English | |||
Green Products RoHS Material Declaration Certificate | Certificate | 170 KB | English | |||
DCG8 Copper Wire IPC 1752-1 V1.01 Class 6 (MCD) | Product Change Notice | 332 KB | English | |||
PCN# : TB1303-02 Change of Tape & Reel Packing Method for Selective Products | Product Change Notice | 361 KB | English | |||
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP | Product Change Notice | 143 KB | English |