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Search has returned 12 results
Title Type Format File Size Language Date
Package Outline Drawing Package Code: DCG8D3 8-SOIC 4.90 x 3.90 x 1.75 mm Body, 1.27mm Pitch Package Outline Drawing PDF 194 KB English
Package Outline Drawing Package Code: DCG8D1 8-SOIC 4.82 x 3.81 x 1.72 mm Body, 1.27mm Pitch Package Outline Drawing PDF 193 KB English
Package Outline Drawing Package Code:DCG8D4 8-SOIC 4.9 x 3.9 x 1.75 mm Body, 1.27mm Pitch Package Outline Drawing PDF 196 KB English
8-SOIC Package Outline Drawing 0.150" Body Width, 0.050" Pitch DCG8D1 Package Outline Drawing PDF 134 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
DCG8 Copper Wire IPC 1752-1 V1.01 Class 6 (MCD) Product Change Notice PDF 332 KB English
PDN# : U-12-03R4 PRODUCT DISCONTINUANCE NOTICE End Of Life Notice PDF 72 KB English
PDN# : U-12-03R3 End Of Life Notice PDF 72 KB English
PCN# : TB1303-02 Change of Tape & Reel Packing Method for Selective Products Product Change Notice PDF 361 KB English
667-01 Datasheet Datasheet PDF 204 KB English
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 143 KB English
PCN# A-0607-06 MMT Thailand as Alternate Assembly Facility for PLCC, SOIC 150mil/300mil Product Change Notice PDF 223 KB English