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Search has returned 17 results
Title Type Format File Size Language Date
Termination Options for High-Speed LVCMOS Driver Clock Drivers Application Note PDF 187 KB English
Package Outline Drawing Package Code: DCG8D3 8-SOIC 4.90 x 3.90 x 1.75 mm Body, 1.27mm Pitch Package Outline Drawing PDF 194 KB English
Package Outline Drawing Package Code: DCG8D1 8-SOIC 4.82 x 3.81 x 1.72 mm Body, 1.27mm Pitch Package Outline Drawing PDF 193 KB English
Package Outline Drawing Package Code:DCG8D4 8-SOIC 4.9 x 3.9 x 1.75 mm Body, 1.27mm Pitch Package Outline Drawing PDF 196 KB English
Clock Distribution Overview Overview PDF 217 KB English
PCN# : A1905-02 Adding Carsem, Malaysia as Alternate Assembly Location & Change Material Sets Product Change Notice PDF 268 KB English
621S IBIS Model Model - IBIS ZIP 22 KB English
8-SOIC Package Outline Drawing 0.150" Body Width, 0.050" Pitch DCG8D1 Package Outline Drawing PDF 134 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
621S Datasheet Datasheet PDF 304 KB English
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 495 KB English
AN-840 Jitter Specifications for Timing Signals Application Note PDF 442 KB English
AN-815 Understanding Jitter Units Application Note PDF 565 KB English
DCG8 Copper Wire IPC 1752-1 V1.01 Class 6 (MCD) Product Change Notice PDF 332 KB English
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 143 KB English