Documentation & Downloads Search
Search has returned
9
results
| Title | Type | Format | File Size | Language | Date | |
|---|---|---|---|---|---|---|
| Package Outline Drawing Package Code: DCG8D3 8-SOIC 4.90 x 3.90 x 1.75 mm Body, 1.27mm Pitch | Package Outline Drawing | 194 KB | English | |||
| Package Outline Drawing Package Code: DCG8D1 8-SOIC 4.82 x 3.81 x 1.72 mm Body, 1.27mm Pitch | Package Outline Drawing | 193 KB | English | |||
| Package Outline Drawing Package Code:DCG8D4 8-SOIC 4.9 x 3.9 x 1.75 mm Body, 1.27mm Pitch | Package Outline Drawing | 196 KB | English | |||
| 8-SOIC Package Outline Drawing 0.150" Body Width, 0.050" Pitch DCG8D1 | Package Outline Drawing | 134 KB | English | |||
| Green Products RoHS Material Declaration Certificate | Certificate | 170 KB | English | |||
| PDN# CQ-14-05 MARKET DECLINED PRODUCT DISCONTINUANCE NOTICE | End Of Life Notice | 192 KB | English | |||
| DCG8 Copper Wire IPC 1752-1 V1.01 Class 6 (MCD) | Product Change Notice | 332 KB | English | |||
| 5V50015 Datasheet | Datasheet | 256 KB | English | |||
| PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP | Product Change Notice | 143 KB | English |