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Search has returned 15 results
Title Type Format File Size Language Date
PCN# : 220030 (R2) Add Alternate Fab Location Product Change Notice PDF 1.59 MB English
PCN# : 220030 (R1) Add Alternate Fab Location Product Change Notice PDF 68 KB English
Package Outline Drawing Package Code: ATG253D1 253-FCCSP (FCBGA) 8.00 x 13.50 x 1.32 mm Body, 0.50 x 0.65mm Pitch Package Outline Drawing PDF 213 KB English
PCN# : 220030 Add Alternate Fab Location Product Change Notice PDF 68 KB English
4RCD0232KC1 Short-Form Datasheet Datasheet - Short-form PDF 119 KB English
PCN# : A1911-01 Adding 2D barcode on product marking Product Change Notice PDF 493 KB English
PCN# A1901-01 : Assembly Sample Open/Short Test Introduced at Amkor and Stats Chippac, Korea Product Change Notice PDF 208 KB English
PCN# : TB1901-01 Adding ASEK Taiwan as Alternate Facility for Test Process Product Change Notice PDF 148 KB English
PCN# : A1908-01 Adding AMKOR and SIMMTECH Korea as Assembly Alternates Product Change Notice PDF 138 KB English
Memory Interface Products Family Overview Overview PDF 515 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
4RCD0232EMKC0 Application Note - LCOM Usage Application Note PDF 331 KB English
IDT DDR4 LRDIMMs Let You Have It All White Paper PDF 1.08 MB English
AT/ATG253 8.00 x 13.50 mm BODY DUAL PITCH (0.50 mm x 0.65 mm) FCCSP Package Outline Drawing PDF 272 KB English
DDR4 LRDIMMs For Both Memory Capacity and Speed White Paper PDF 5.22 MB English