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Search has returned 33 results
Title Type Format File Size Language Date
Termination Options for High-Speed LVCMOS Driver Clock Drivers Application Note PDF 187 KB English
AN-805 Recommended Ferrite Beads Application Note PDF 91 KB English
Package Outline Drawing Package Code: DCG8D3 8-SOIC 4.90 x 3.90 x 1.75 mm Body, 1.27mm Pitch Package Outline Drawing PDF 194 KB English
Package Outline Drawing Package Code: DCG8D1 8-SOIC 4.82 x 3.81 x 1.72 mm Body, 1.27mm Pitch Package Outline Drawing PDF 193 KB English
Package Outline Drawing Package Code:DCG8D4 8-SOIC 4.9 x 3.9 x 1.75 mm Body, 1.27mm Pitch Package Outline Drawing PDF 196 KB English
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.99 MB English
Clock Distribution Overview Overview PDF 217 KB English
8-SOIC Package Outline Drawing 0.150" Body Width, 0.050" Pitch DCG8D1 Package Outline Drawing PDF 134 KB English
Green Products RoHS Material Declaration Certificate Certificate PDF 170 KB English
AN-828 Termination - LVPECL Application Note PDF 322 KB English
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB English
AN-844 Termination - AC Coupling Clock Receivers Application Note PDF 170 KB English
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 495 KB English
AN-840 Jitter Specifications for Timing Signals Application Note PDF 442 KB English
AN-834 Hot-Swap Recommendations Application Note PDF 153 KB English
AN-815 Understanding Jitter Units Application Note PDF 565 KB English
DCG8 Copper Wire IPC 1752-1 V1.01 Class 6 (MCD) Product Change Notice PDF 332 KB English
System Applications and Design Guidelines with IDT’s Zero-Delay Buffers Application Note PDF 294 KB English
PCN# : A1208-01R1 Gold to Copper Wire Product Change Notice PDF 254 KB English
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB English
AN-229: Zero Delay Buffers Application Note PDF 120 KB English
23S05E Datasheet Datasheet PDF 119 KB English
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 143 KB English
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB English
23S05E IBIS model Model - IBIS ZIP 24 KB English
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB English
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB English
PCN # A-0406-06 Qualify OSE Philippines for SOIC Product Change Notice PDF 100 KB English
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB English
23S05E Hspice Model Model - SPICE ZIP 110 KB English
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB English
AN-82 Clock Distribution with Guaranteed Skew Application Note PDF 214 KB English