RA6M5 MCU 群组评估套件
EK-RA6M5 评估套件可通过灵活配置软件包 (FSP) 和 e2 studio IDE,帮助用户对RA6M5 MCU 群组的特性进行无缝评估,并对嵌入系统应用程序进行开发。用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
入门
运行快速入门示例项目
- EK-RA6M5...
The CK-RA6M5 cloud kit enables users to securely connect to the cloud and explore the features of the Cortex®-M33 based RA6M5 group of MCUs and cloud services. With multiple network connectivity options, the kit provides a seamless cloud connectivity experience to most of the global cloud service providers. It is equipped with an onboard Ethernet PHY for Ethernet connectivity. The kit is available with two options for wireless connectivity – Wi-Fi connectivity using DA16600 Wi-Fi-BLE combo module Pmod and cellular connectivity with RYZ014A LTE CAT-M1 module Pmod. With the Renesas Flexible Software Package (FSP), the kit has complete software stack support using FreeRTOS, Azure RTOS and other middleware stacks, thereby making it an ideal platform for efficiently developing cloud solutions and greatly reducing the time-to-market.
Visit Renesas Cloud Solutions for complete cloud solution package.
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灵活配置软件包 (FSP) FSP 是一款增强型软件包,旨在为使用瑞萨电子 RA 系列 Arm 微控制器的嵌入式系统设计提供简单易用且可扩展的高质量软件。
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Software Package | 瑞萨电子 |
Quick-Connect Platform Quick-Connect platform enables fast prototyping by providing compatible hardware and software building blocks.
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Other Hardware | 瑞萨电子 |
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EK-RA6M5 评估套件可通过灵活配置软件包 (FSP) 和 e2 studio IDE,帮助用户对RA6M5 MCU 群组的特性进行无缝评估,并对嵌入系统应用程序进行开发。用户可利用丰富的板载功能以及自选的热门生态系统插件来将丰富创意变为现实。
The US159-DA16600EVZ is a highly integrated ultra-low-power Wi-Fi + Bluetooth® Low Energy Combo Pmod module that provides a convenient way to add both low power Wi-Fi...
Watch a short overview of the Renesas CK-RA6M5 and CK-RX-65N certified cellular-to-cloud IoT development kits to see how they can simplify solution prototyping for your next IoT design. Visit renesas.com/cloudsolutions to get started.
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