Overview

The Intersil Satellite Applications Flow™ (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers while maintaining a high level of reliability. The Intersil HS-6664RH-T is a radiation hardened 64K CMOS PROM, organized in an 8K word by 8-bit format. The chip is manufactured using a radiation hardened CMOS process and utilizes synchronous circuit design techniques to achieve high-speed performance with very low power dissipation. On-chip address latches are provided, allowing easy interfacing with microprocessors that use a multiplexed address/data bus structure. The output enable control simplifies system interfacing by allowing output data bus control in addition to the chip enable control. All bits are manufactured storing a logical 0 and can be selectively programmed for a logical 1 at any bit location.

HS-6664RH-T Functional Diagram
HS-6664RH-T Functional Diagram
  • QML Class T, per MIL-PRF-38535
  • Radiation performance
  • Gamma dose 1 x 105 RAD(Si)
  • No latch-up, SEU LET >100MeV/mg/cm2
  • Transient output upset >5 x 108 RAD (Si)/s
  • Fast access time - 35ns (Typical)
  • Single 5V power supply, synchronous operation
  • Single pulse 10V field programmable NiCr fuses
  • On-chip address latches, three-state outputs
  • Low standby current <500µA (Pre-Rad)
  • Low operating current <15mA/MHz
  • Electrically screened to SMD # 5962-95626

Documentation

= Featured Documentation
Type Title Date
Datasheet
HS-6664RH-T Datasheet
PDF 339 KB
Brochure
Intersil Commercial Lab Services
PDF 467 KB
Brochure
Intersil Space Products Brochure
PDF 4.85 MB
Other
Standard Microcircuit Drawing 5962-95626 (HS-6664RH, HS-6664RH-T)
White Paper
Wafer by Wafer Low Dose Rate Acceptance White Paper
PDF 533 KB
Product Advisory
PA11003 - Packing Method Change for Intersil TO-xx Metal Can and Flat Pack Packaged Products
PDF 499 KB
Product Change Notice
PCN10123 - Alternate Die Attach Material for Assembly of Intersil Hermetic Packaged Products - Intersil Palm Bay, FL. (ISP)
PDF 230 KB
Application Note
AN9867: End of Life Derating: A Necessity or Overkill
PDF 338 KB
8 items

Design & Development

ECAD Models

Schematic symbols, PCB footprints, and 3D CAD models from SamacSys can be found by clicking on products in the Product Options table. If a symbol or model isn't available, it can be requested directly from the website.

Explore ECAD Models
Diagram of ECAD Models

Product Options

    Processing table
    Pkg. Type
    Carrier Type
    MOQ
    DLA SMD
    Buy / Sample
    Part Number
    HS1-6664RH-T
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    		SBDIP 450 5962R9562601TXC
    HS9-6664RH-T
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    		CFP 450 5962R9562601TYC
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