List of IC Packages (PKG Type)
Surface-mount Type | Gull Wing Lead Package | Quad Lead | QFP | HQFP | LQFP | HLQFP | TQFP | HTQFP | |
---|---|---|---|---|---|---|---|---|---|
FQFP | HFQFP | LFQFP | HLFQFP | TFQFP | HTFQFP | PLCC | |||
Dual Lead | SOP | HSOP | MSOP | HMSOP | |||||
SSOP | HSSOP | LSSOP | TSSOP | HTSSOP | |||||
TSOP(1) | TSOP(2) | SC70 | SOT23 | TSOT | |||||
Non-lead | Quad Lead | VQFN | HVQFN | WQFN | HWQFN | HXQFN | UQFN | ||
Dual Lead | USON | WSON | HWSON | HUSON | XSON | HXSON | OSON | ||
Area Array | Ball | BGA | HBGA | FBGA | HFBGA | LBGA | LFBGA | ||
TFBGA | VFBGA | WLCSP | |||||||
Land | TFLGA | UFLGA | VFLGA | WFLGA | XFLGA | ||||
Module | MODULE | ||||||||
Through Hole Type | DIP | SDIP | SIP | HSIP | ZIP | ||||
Hermetic | CAN | CERDIP | CFP | CLCC | CPGA | CQFP |
Note: Package information is also found on the ordering tab of the detailed product page.
Symbol Meanings
Symbol | The Meaning of the Symbols |
---|---|
H: Heat Sink | with Heat Sink |
L: Low Profile | Maximum seated height, 1.2mm < L ≦ 1.7mm |
T: Thin | Maximum seated height, 1.0mm < T ≦1.2mm |
V: Very Thin | Maximum seated height, 0.8mm < V ≦1.0mm |
W: Very Very Thin | Maximum seated height, 0.65mm < W ≦0.8mm |
U: Ultra Thin | Maximum seated height, 0.5mm < U ≦0.65mm |
X: Extremely Thin | Maximum seated height, X ≦ 0.5mm |
F: Fine Pitch | Terminal pitch is 0.5mm or less. (only used for QFP) Terminal pitch is 0.8mm or less. (only used for BGA, LGA) |
S: Shrink | Shrink pitch of basic package (only used for SOP, DIP, ZIP, PGA) |
O: Optical | Uses optically clear mold compound for optical devices |