List of IC Packages (PKG Type)
| Surface-mount Type | Gull Wing Lead Package | Quad Lead | QFP | HQFP | LQFP | HLQFP | TQFP | HTQFP | |
|---|---|---|---|---|---|---|---|---|---|
| FQFP | HFQFP | LFQFP | HLFQFP | TFQFP | HTFQFP | PLCC | |||
| Dual Lead | SOP | HSOP | MSOP | HMSOP | |||||
| SSOP | HSSOP | LSSOP | TSSOP | HTSSOP | |||||
| TSOP(1) | TSOP(2) | SC70 | SOT23 | TSOT | |||||
| Non-lead | Quad Lead | VQFN | HVQFN | WQFN | HWQFN | HXQFN | UQFN | ||
| Dual Lead | USON | WSON | HWSON | HUSON | XSON | HXSON | OSON | ||
| Area Array | Ball | BGA | HBGA | FBGA | HFBGA | LBGA | LFBGA | ||
| TFBGA | VFBGA | WLCSP | |||||||
| Land | TFLGA | UFLGA | VFLGA | WFLGA | XFLGA | ||||
| Module | MODULE | ||||||||
| Through Hole Type | DIP | SDIP | SIP | HSIP | ZIP | ||||
| Hermetic | CAN | CERDIP | CFP | CLCC | CPGA | CQFP | |||
Note: Package information is also found on the ordering tab of the detailed product page.
Symbol Meanings
| Symbol | The Meaning of the Symbols |
|---|---|
| H: Heat Sink | with Heat Sink |
| L: Low Profile | Maximum seated height, 1.2mm ＜ L ≦ 1.7mm |
| T: Thin | Maximum seated height, 1.0mm ＜ T ≦1.2mm |
| V: Very Thin | Maximum seated height, 0.8mm ＜ V ≦1.0mm |
| W: Very Very Thin | Maximum seated height, 0.65mm ＜ W ≦0.8mm |
| U: Ultra Thin | Maximum seated height, 0.5mm ＜ U ≦0.65mm |
| X: Extremely Thin | Maximum seated height, X ≦ 0.5mm |
| F: Fine Pitch | Terminal pitch is 0.5mm or less. (only used for QFP) Terminal pitch is 0.8mm or less. (only used for BGA, LGA) |
| S: Shrink | Shrink pitch of basic package (only used for SOP, DIP, ZIP, PGA) |
| O: Optical | Uses optically clear mold compound for optical devices |